XingQiang HDI Thick Copper Multilayer PCB

 XingQiang delivers premium custom high-density multilayer PCBs with outstanding advantages in technology, delivery, and after-sales service. We specialize in HDI, blind and buried vias, fine pitch BGA, impedance control, and high-speed signal designIdeal for medical, aerospace, industrial, and high-end electronic devices, our PCBs adhere to strict quality standards, ensuring excellent thermal management, signal stability, and consistent performance for prototype and mass production.

How to customize your  HDI Printed Circuit Boards?

Send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)

Normally Gerber files Include:PCB Types,Product thickness, Ink color, Surface treatment process and SMT requirement.

We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.

Manufacturing Challenges of Advanced Multilayer HDI Circuit Boards:

• High-layer count structure leads to complicated lamination and interlayer alignment control.
• Microvia and fine-pitch design requires laser drilling accuracy and stable etching technology.
• High-speed signals need strict impedance matching to avoid crosstalk and transmission errors.
• Thermal management is critical to prevent layer separation and performance degradation.
• Strict quality testing including short/open circuit check and reliability test adds production complexity.

          Factory showcase

          PCB Quality Testing

    Certificates and Honors