Gold Plating Process Double Sided PCB FR4 Material ENIG Process Customized Service

Electroplated Gold Double - Sided PCB Board – Superior Durability for High - End Electronic Devices

This type of PCB has a double-sided copper design, with conductive patterns on both sides of the insulating substrate. The gold plating is applied through an electroplating process, providing excellent wear resistance and strong anti-oxidation properties, making it suitable for high-reliability electronic devices. The manufacturing process involves key steps such as cutting, drilling, copper deposition, pattern electroplating, and gold plating, where the gold layer is deposited on the copper foil through a catalytic electroplating process. 

Key Features of Double-Sided PCBs:

1. Dual Copper Layers: Conductive copper traces exist on both sides (top & bottom) of the insulating substrate (e.g., FR-4).
2. Plated Through-Holes (PTHs): Essential metalized holes electrically connect circuits between the two layers, enabling vertical routing.
3. Increased Density & Complexity: Supports significantly more components and traces than single-sided boards by utilizing both surfaces and cross-layer connections via PTHs.
4. Design Flexibility: Offers greater routing freedom for complex circuits, overcoming the limitations of single-layer designs.
5. Component Mounting: Accommodates both SMD (Surface Mount) and through-hole components on either or both sides of the board.
6. Standard Finishes: Typically includes solder mask (insulation/protection) and silkscreen (markings) applied to one or both sides.

Double-sided PCB customization services

Send us your:
1. Gerber files (RS-274X)
2. BOM (if PCBA needed)
3. Impedance requirements & stack-up (if available)
4.Test requirements (TDR, network analyzer, etc.)

Noted:Normally,Gerber files includes: PCB type,thickness, ink color, surface treatment process, and if SMT processing is required, you can provide a component BOM and reference designation diagram, etc.

We’ll reply within 24 hours with a free quote, DFM report, and material recommendation.

Manufacturing process:

→ Copper Cladding (double-sided copper foil on insulating substrate) 

→ Drilling (creating holes for interconnections)

→ Plating (electroplating copper to strengthen hole walls) 

→ Imaging (transferring circuit patterns to both sides)

→ Etching (removing excess copper to form conductive traces)

→ Solder Mask Application (adding protective coating)

→ Surface Finish (e.g., gold plating for durability) → Silk Screening (adding component labels) → Electrical Testing (verifying conductivity and connections) → Final Inspection and Packaging.

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