XRay Inspection Machine for Electronic Component Inspection
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Detailed Product Description
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X-Ray Inspection Machine for Electronic Component Inspection Wellman 60° Tiltable FPD X-Ray System for BGA Solder Void Analysis The Wellman Microfocus X-Ray Inspection System X6000 features a
maintenance-free X-ray tube system that enables efficient
inspection of BGA solder voids and PCB through-holes, paired with
high-precision imaging capabilities. Key Advantages
Technical Specifications X-ray Source
Flat Panel Detector
Work Table
Equipment Parameters
Safety Features
Software Capabilities Basic Operation Full keyboard and mouse control for all functions, including X-ray
tube activation and parameter adjustment. Measurement Tools Comprehensive measurement tools for distance angle radius perimeter
and distance rate perfect for through hole soldering analysis. Automated Inspection Three modes available: manual point setting, array pattern for
regular points, and automatic feature recognition to enable
efficient batch processing. Image Processing Adjustable brightness, contrast, and gain to achieve optimal image
quality. Save and retrieve inspection parameters for repeated
inspections. Voids Rate Measurement Automatically calculates solder ball void rate, area, and
circumference while identifying defects, and supports manual void
marking and parameter saving for consistent results. Application Examples X6000 inspection application example 1 Working Principle X6000 X-ray inspection system working principle |
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| Product Tags: XRay inspection machine for electronics electronic component XRay machine XRay machine with warranty |
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