60° Tiltable FPD X Ray Inspection Machine BGA Solder Void Analysis
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Detailed Product Description
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60° Tiltable FPD X-Ray System for High Resolution Imaging and BGA
Solder Void Analysis The Wellman Microfocus X-Ray Inspection System X6000 features a
maintenance-free X-ray tube system that enables efficient
inspection of BGA solder voids and PCB through-holes, paired with
high-precision imaging capabilities. Key Advantages
Technical Specifications X-ray Source
Flat Panel Detector
Work Table
Equipment Parameters
Safety Features
Working Principle X6000 X-ray inspection system working principle Software Capabilities Basic Operation Full keyboard and mouse control for all functions, including X-ray
tube activation and parameter adjustment. Measurement Tools Comprehensive measurement functions include distance, angle,
radius, perimeter, and distance rate calculations, ideal for
through-hole soldering analysis. Automated Inspection Three modes available: manual point setting, array pattern for
regular points, and automatic feature recognition to enable
efficient batch processing. Image Processing Adjustable brightness, contrast, and gain to achieve optimal image
quality. Save and retrieve inspection parameters for repeated
inspections. Voids Rate Measurement Automatically calculates solder ball void rate, area, and
circumference while identifying defects, and supports manual void
marking and parameter saving for consistent results. Application Examples X6000 inspection application example 1 X6000 inspection application example 2 |
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| Product Tags: 60° tiltable X-ray machine high-resolution FPD X-ray system BGA solder void analysis machine |
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