Nanoscale CT/3D inspection equipment designed for comprehensive
quality analysis in industrial manufacturing applications.
Equipment Characteristics
- 2D/2.5D imaging with multi-axis linkage for ROI imaging
- Advanced imaging enhancement capabilities
- Automatic analysis and image analysis functions
- Scanning programming functionality
- Optional rotating disk imaging module for multi-angle observation
- 3D imaging for local devices on complete boards
- Turntable and cone-beam CT imaging options for small devices
Detection Applications
- Large size PCBA board inspection
- Internal structural quality analysis of semiconductor packaging
- SMT welding quality assessment including:
- Open welding detection
- Infiltration analysis
- Solder amount measurement
- Offset detection
- Foreign body identification
- Bridge and pin inspection
Technical Specifications
| X-ray Source Parameters |
|---|
| X-ray Tube Type | Closed-tube X-ray source |
| Tube voltage range | 20-160 KV |
| Detector parameter |
|---|
| Detector type | Amorphous silicon fat panel detector |
| Pixel size | 100 μm |
| Pixel matrix | 1536*1536 |
| Equipment Performance Parameters Details |
|---|
| Maximum possible sample size | Flat test bench 580*530mm
Rotating test stand 300*300mm
Rollover test stand 250*300mm |
|
| Maximum imaging area | Flat test bench 460*410mm
Rotating test stand 300*300mm
Rollover test stand 250*100mm |
|
| JIMA card resolution | Standard 0.9μm, max 0.5μm |
|
| Equipment weight | 4T |
|
| Equipment size | 1800 mm*1800 mm*2300 mm (Length * width * height) |
|
| Imaging software system | Integrated scanning imaging software
3D image reconstruction software
3D image measurement and analysis software
Image database management software |
|
