China SMT Equipment manufacturer
Guangdong Okai Intelligent Technology Co., Ltd.
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High Precision SMT Solder Paste Printer | Touch Screen & PLC Control

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Guangdong Okai Intelligent Technology Co., Ltd.

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:86-17825484428

Contact Person:
Mr.Cai
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High Precision SMT Solder Paste Printer | Touch Screen & PLC Control

Brand Name Okai Intelligent Technology Co., Ltd.
Model Number Okai-SASPP
Place of Origin Mainland China
Minimum Order Quantity MOQ: 1 SET
Price open to negotiation
Payment Terms ,T/T
Supply Ability 1000 Sets / Month
Delivery Time 5-8 work days
Packaging Details Wooden case packaging, suitable for sea/air transportation。Each machine packed in a fumigated wooden case, size: L×W×H cm, gross weight: X kg
Certification ISO 9001
Detailed Product Description

Our SMT Solder Paste Printer is engineered for reliable, high-precision performance in electronics manufacturing.

**Key Features**
- Closed sheet metal and aluminum alloy structure design ensures the highest level of safety protection.
- Intuitive touch-screen control interface with automatic fault diagnosis for convenient human-machine interaction.
- Multiple sound-light alarms and in-screen prompt alerts for real-time operation monitoring.
- PLC control system guarantees stable and reliable operation under continuous production.
- Upper/lower cylinders paired with linear guides ensure perfectly balanced ascending and descending movement.
- Left/right stepper motors, linear guides and frequency converter deliver uniform speed and precise parallelism.
- Fine-tuning knobs for X and Y axes enable accurate alignment adjustment.
- Variable frequency speed control motor ensures smoother and more stable equipment operation.

**Applications**

- In the production of PCBs for consumer electronics (mobile phones, computers, tablets, etc.), it precisely prints solder paste onto PCB pads to prepare for component soldering.
- This semi-automatic printer can also be used for thermal grease printing, accurately applying it between heat-generating components and heat dissipation devices to ensure uniform coating, thus enhancing the heat dissipation efficiency and operational stability of electronic equipment.

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