China Semi Automatic BGA Rework Station manufacturer
Shenzhen Wisdomshow Technology Co.,ltd
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High Precision BGA Rework Station ZM-R6200 LED Module Repair Machine with Laser Position HDD Camera

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Shenzhen Wisdomshow Technology Co.,ltd

City: shenzhen

Country/Region:china

Tel:86-189-2653-8696

Contact Person:
Ms.Elysia View Contact Details

High Precision BGA Rework Station ZM-R6200 LED Module Repair Machine with Laser Position HDD Camera

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Minimum Order Quantity 1
The Power Supply 5300W
Type Semi Automatic
Weight 12kg
Weight Of Machine 60KG
Maximum Mouting Load 150G
Core Components PLC
Model Number WDS620
Apply Chip Size 0.8*0.8~120*120mm
Max Mouting Load 150g
Application BGA (Ball Grid Array) Rework
Applicable Pcb Thickness 0.5-5mm
Certification CE, ISO, FDA
Place of Origin CHINA
Mounting Accuracy ±0.01mm
Voltage 220V
Pcb Size Max. 470x380mm
Bga Chip Size Max120*120mm Min 0.8*0.8mm
Brand Name WISDOMSHOW
Chip Size Min 1*1mm
Detailed Product Description
Hot Air Infrared Combo BGA Rework Station WDS620
High Precision BGA Reballing Machine - WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine
Technical Specifications
Power SupplyAC 220V±10% 50/60Hz
Total Power5200W
Upper Heater PowerMax 1200W
Lower Heater PowerMax 1200W
IR Heater PowerMax 2700W
Detailed Parameter Specification
Power SupplyAC 110V/220V±10% 50/60Hz
Total PowerMax 5300W
Heater Power DistributionUpper zone: 1200W, Second zone: 1200W, IR zone: 2700W
Electrical ComponentsDriving motor + PLC smart temperature controller + color touch screen
Temperature ControlHigh precision K-sensor (Closed Loop), independent temperature controller, precision ±1℃
Positioning SystemV-shape slot, adjustable PCB support jigs, laser light for fast centering and positioning
PCB Size RangeMax 500*380mm, Min 10*10mm
Applicable Chip SizesMax 80*80mm, Min 1*1mm
Overall Dimensions650*630*850mm (L*W*H)
Temperature Interface1 unit
Machine Weight60KG
ColorWhite & Blue
Advanced Operating Modes
The WDS-620 features 5 operational modes: Remove, Mount, Weld, Manual, and Semi-auto. Operators can freely switch between automatic, semi-automatic, and manual operation modes.
Independent 3-Zone Temperature Control System
  • Upper and lower hot air heating simultaneously targets components and PCB
  • Bottom IR heating with temperature precision control within ±1℃
  • 8-segment independent temperature control system
  • Hot air district heating for BGA and PCB simultaneously
  • Large area IR heater preheating prevents PCB deformation during rework
  • Upper and lower temperature zones can operate independently or combined
  • High precision K-type thermocouple closed-loop control with PID parameter self-setting
  • 4 temperature curves display with instant analysis function
  • Multiple user data profiles can be saved
  • External measurement interface for precise temperature testing
Precision Optical Alignment System
High-definition adjustable CCD color optical alignment system with beam split, amplification, reduction, and auto-focus capabilities. Features automatic color aberration resolution, brightness adjustment, and adjustable image contrast. Equipped with 15" high-definition LCD monitor.
Multi-Functional Operation System
  • High-definition touch human-machine interface
  • Upper heating head and mounting head designed as 2-in-1 unit
  • Multiple titanium alloy BGA nozzles with 360-degree rotation
  • X, Y, and R angle micrometer fine-tuning with ±0.01mm precision
Safety Protection Features
  • Automatic alarm function after BGA welding completion
  • Automatic circuit power-off during temperature abuse conditions
  • Dual over-temperature protection system
  • Temperature parameter password protection to prevent unauthorized modifications
Product Tags: BGA rework station with laser position   LED module repair machine with HDD camera   semi automatic BGA rework station  
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