Software Control Infrared BGA Rework Station WDS-900 300KG High speed
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Software Control Infrared BGA Rework Station WDS-900 300KG High speedWDS-900 BGA rework machine specification: 1,Model: WDS-900 2,Max PCB size:W760*D630mm 3,PCB thickness:0.5～8mm 4,suit chips size:1*1～120*120mm 5... |
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| Product Tags: Software Control Infrared BGA Rework Station WDS-900 Infrared BGA Rework Station Software Control Infrared Soldering Station |
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