High Capacity PID Adjustment Semiconductor Oven SEO Series Air
Tightness
The semiconductor oven with nitrogen filled has
strong universality, high stability and high performance. It adopts
high capacity horizontal air recycling system, adopts special
chamber structure and sealing technology, with excellent air
tightness and temperature uniformity to meet the high performance
requirements of semiconductor products. This oven is suitable for
curing semiconductor wafers, IC packages (copper substrate, silver
gel, silica gel, epoxy resin), glass substrate and other products.
Core Technology:
01 High capacity horizontal air recirculation hot air system to
achieve high performance temperature uniformity
02 The chamber is fully sealed design, adopts stainless steel
plate, with good air tightness, saving nitrogen
03 High power high temperature resistant long axis motor, and large
size turbine blade, which can work stably in high temperature
environment for a long time
04 The heating rate is controllable, one-key operation for the
process profile setting, with cooling system for cooling, which can
effectively improve production efficiency
05 High precision temperature controller, PID adjustment, the
control accuracy can reach 0.5℃, reliable control, safe use
06 Efficient clean treatment, thousand-grade cleanroom aging test,
to meet the requirements of semiconductor dust-free workshops and
products
07 Low oxygen content control, real-time monitoring, dual channel
analysis system the oxygen content can be controlled within 50PPM
Product features:
SEMICONDUCTOR OVEN CHAMBER STRUCTURE
The upper and lower boxes are equipped with hot air
circulation system, the air speed and volume can be adjusted, and
different process parameters can be operated independently. The
furnace chamber is made of high quality stainless steel. The
furnace is equipped with layered brackets to improve space
utilization.
SEMICONDUCTOR OVEN NITROGEN SYSTEM
Nitrogen filling inside the chamber, equipped with
multiple flow meter, with independent adjustment function, to
ensure the reasonable use of nitrogen, balanced distribution. With
multi-channel oxygen analyzer, real-time monitoring of the oxygen
content value in the upper and lower chambers, can be controlled
separately, the oxygen content of a single chamber can be
controlled within 500PPM (option: within 100PPM).
SEMICONDUCTOR OVEN COOLING SYSTEM
Water cooling system is adopted. Fin radiator blast
water cooling, when the temperature in the furnace is cooling, the
blower will exchange heat through the fin radiator quickly, it
greatly shortens the cooling time. Unique cooling system, avoid
instant cooling steam expansion at high temperature, which
effectively protect product quality.
SEMICONDUCTOR OVEN SAFETY PROTECTION SYSTEM
With over-temperature protection (to prevent the
studio temperature is too high and protect the product), when the
over-temperature situation occurs, it will immediately cut off the
power, at the same time, there is an alarm to remind the staff,
better protection for products; control and protection of excessive
oxygen content; nitrogen low pressure alarm protection; upper and
lower boxes are equipped with electronic safety locks, and the
equipment has emergency stop switch.
SEMICONDUCTOR OVEN CLARITY TEST
After testing, the concentration of 0.5μm particle is
≤35200, which meets the production requirements of high-cleanliness
thousand-class clean dust-free workshop.
SEMICONDUCTOR OVEN TEMPERATURE PROFILE TEST
High precision temperature controller, PID
regulation, high capacity horizontal air recirculation hot air
system, which can achieve high performance temperature uniformity.
Product Parameters:
| Model No | SEO-100N |
| Box part |
| Box dimension | 700(L)*550(W)*(600*2)(H)mm |
| Number of boxes and working mode | Two boxes, each box can run independently
(1 to 4 boxes are optional.) |
| Hot air system | Hot air circulation system with adjustable air speed and volume |
| Cooling system | Water cooling circulation system, according to customer workshop
cooling water |
| Nitrogen system | With flow meter and oxygen analyzer to display oxygen content in
real-time |
| Internal specification | Equipped with the stainless steel support shelves, with adjustable
spacing between shelves |
| Control system |
| Temperature operating range | Room temperature+10℃~250℃ |
| Temperature control mode | PID closed-loop control+SSR drive |
| Control system | PC+PLC electrical control system, Windows operating interface |
| Temperature accuracy | ±0.5℃ |
| Temperature uniformity | ±1.5%℃(no-load) |
| Heating up time | ≤15min(200℃ no-load) |
| Cooling rate | 2-5℃/min |
| Heating power | 10KW*2 |
| Oxygen content control | ≤500PPM (Option:≤50PPM) |
| Working voltage | AC3Ø 5W 380V 50/60HZ |
| Total power | 21KW |
| MES communication protocol | Standard |
| Cleanliness class | Class 1000 |
| Machine Parameter |
| Dimension(LxWxH) | 1700(L)*1200(W)*1800(H)mm |
| Weight | 500-800kg |
| Color | Bright wrinkled white |
Notices:
1.Gas source requirements: Nitrogen working pressure (pressure
during use)>0.5-0.8Mpa, nitrogen purity 99.999%.
2.Power requirements:
①Three phase five wire: voltage 380V, frequency 50/60HZ;
②Wire diameter above 25mm², leakage protection switch 100A, leakage
protection switch leakage capacity 150-200mA.
3.Ground pressure requirement: 1000kg/m².
4.External ventilation requirements: 2-Ø38mm outer diameter air
duct, ventilation volume of 2*5M³/min;
5.Environmental requirements: The ambient temperature range should
be between 5-40℃, and the relative humidity range should be between
20-95%.
