IC Bonding Machine
|
Detailed Product Description
|
IC Bonding Machine
The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power device, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.
IC Bonder Machine
|
| Product Tags: combined selective multi module wave solder wave soldering multi module combined selective combined multi module wave solder selective |
Related Products
|
Multilayer IC Bonding Machine 0.25*0.25mm-10*10mm Die Bonder Equipment |
|
High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders |
|
Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine |
|
High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine |
|
Sintering Die Bonder SDB 200 |
|
IC Bonding Machine |
Email to this supplier