Quality

Standard: ISO9001 Number: CNQMS047967 Issue Date: 2021-06-21 Expiry Date: 2024-06-21 Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging Issued By: NSFInternational Strategic Registrations

Standard: IATF 16949:2016 Number: 0406197 Issue Date: 2021-06-21 Expiry Date: 2024-06-21 Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging Issued By: NSFInternational Strategic Registrations

Standard: GB/T24001-2016/IS014001:2015 Number: 2052022E00126R2M Issue Date: 2022-07-25 Expiry Date: 2026-07-24 Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging Issued By: IAF and CNAS

Standard: Integration of Informatizafion and Industrialization Management System Certificate Number: AIITRE-00123IIIMS0470801 Issue Date: 2023-05-26 Expiry Date: 2026-05-25 Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging Issued By: CEPREI

Standard: GJB 9001C-2017 Number: 02623J31381R0M Issue Date: 2023-06-27 Expiry Date: 2026-06-26 Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging Issued By: BTCC-GJB