China eMMC5.1 manufacturer
China Chips Star Semiconductor Co., Ltd.
China Chips Star Semiconductor Co., Ltd.
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BGA Original New 32/64G EMMC Memory Chip IC Electronic Components eMMC Factory

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China Chips Star Semiconductor Co., Ltd.

Country/Region:china

Tel:86--15712055204

Contact Person:
Ms.Sunny Wu
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BGA Original New 32/64G EMMC Memory Chip IC Electronic Components eMMC Factory

Brand Name PG
Model Number G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB
Place of Origin Shenzhen, China
Minimum Order Quantity 50pcs
Price Negotiable
Payment Terms L/C,T/T
Supply Ability 100K a month
Delivery Time 10 to 15 days
Product name Original New emmc
Capacity Typically ranges from 64GB to 256GB
Feature Low
Warranty 1 year
Nand Flash TLC
Sequential Write Speed Up To 240 MB/s
Appearance 11.5mmx13mmx1.0mm
Protocol HS400
Detailed Product Description
BGA Original New 32/64G EMMC Memory Chip IC Electronic Components eMMC Factory
As a highly integrated and stable memory chip, eMMC is widely used in various products such as smart Bluetooth speakers, WiFi voice speakers and car audio speakers. The large-capacity 32GB / 64GB eMMC chips in BGA package can perfectly meet the core requirements of smart speakers for system operation, audio storage, voice interaction, offline caching and so on, making them key electronic components for smart audio devices.
Key Features of EMMC Chips

1.Main Applications of eMMC in Smart Speakers
System Firmware & Operating System Storage
Stores the boot program, drivers, and operating system of the speaker’s main control chip.
Ensures fast startup and stable operation, preventing program loss or abnormal booting.
Supports OTA system updates for convenient later function iteration and bug fixes.


2. Large-Capacity Local Audio File Storage
32G/64G large capacity can store thousands of high-quality music tracks, audiobooks, children’s songs, white noise, and more.
Enables offline playback without relying on a network, improving user experience.
Compared with TF cards, eMMC uses an on-board BGA package, which is shockproof, loose-proof, and more stable.


3.Local Caching for Voice Assistants & AI Algorithms
Stores voice wake-up models and offline speech recognition lexicons.
Caches conversation logs and frequently used commands for faster response and usability under weak network conditions.
Works with DSP for audio data processing, enhancing radio reception, noise reduction, and human voice recognition performance.

EMMC 5.1 Specification Comparison
ModelG2864GTLCBG28128TLCBG28256TLCB
NAND Flash3DTLC NAND3DTLC NAND3DTLC NAND
Capacity64GB128GB256GB
CE124
Read Speedup to 330MB/sup to 330MB/sup to 330MB/s
Write Speedup to 240MB/sup to 240MB/sup to 240MB/s
Operating Temperature-25℃~85℃-25℃~85℃-25℃~85℃
EP≥3000≥3000≥3000
Packaging SpecificationBGA 153BGA 153BGA 153
Size11.5mm×13mm×1.0mm11.5mm×13mm×1.0mm11.5mm×13mm×1.2mm
Manufacturer: China Chips Star Semiconductor Co., Ltd.
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