About TECircuit Found: TECircuit has been operating since 2004.
Location: An electronics manufacturing service(EMS) provider located in
Shenzhen China.
Item: Customizable EMS PCB, offers a full range of one-stop shop services.
Service: Printed Circuit Board (PCB)and Printed Circuit Board Assembly(PCBA), Flexible Printed Circuit Board(FPC), Components Sourcing, Box-Building, Testing.
Quality Assurance: UL,ISO 9001, ISO 14001, ISO 13485, ITAF 16949 andcomplied with ROHS and REACH.
Factory Pictures:
Company's own plant : 50,000 sqm; Employees : 930+; Monthly
production capacity : 100,000 m2 PCBA Applications Network Installation and Maintenance: The PCBA drives the core functions for technicians to certify
fiber optic cable installations, measuring critical parameters like
total end-to-end optical power loss to ensure links meet industry standards before system
commissioning. Fault Location and Troubleshooting: It powers Optical Time-Domain Reflectometer (OTDR) functionality, analyzing backscattered light to precisely locate
breaks, severe bends, or faulty connectors along a fiber span,
dramatically reducing repair time. Passive Optical Network (PON) and Telecommunications: Specialized PCBAs enable testing in live PON networks, allowing
technicians to measure power levels on specific wavelengths without
disrupting service, which is essential for maintaining FTTH (Fiber
to the Home) infrastructure. Data Center and Enterprise Network Quality Assurance: Used to verify and document the performance of patch cords, trunk
cables, and installed fiber within data centers, ensuring
high-speed backbone connections have sufficient signal margin for
reliable operation. Fiber Characterization and Laboratory Research: High-precision PCBA designs are used in R&D and manufacturing
environments to characterize the detailed properties of fiber, such
as chromatic dispersion and polarization mode dispersion, for
advanced system design. Educational and Training Tool: Serves as a practical platform for students and trainees to learn
fiber optic theory, practice hands-on splicing, and understand how
to interpret loss budgets and OTDR trace data.
PCBA Features Laser Diode Driver & High-Sensitivity Photodetector: The PCBA incorporates precise laser driver circuits to emit
stable, calibrated light pulses or signals at specific wavelengths
(e.g., 850nm, 1310nm, 1550nm). It pairs this with a
high-sensitivity photodetector and transimpedance amplifier to
convert faint optical signals into accurate electrical
measurements. High-Precision Timing & Signal Processing Circuitry: For OTDR and loss test units, the board features ultra-stable
timing circuits (using TCXOs or GPSDOs) to measure the
nanosecond-scale return time of light. A high-speed ADC and FPGA or
DSP perform real-time signal averaging and processing to extract
usable data from noisy backscatter signals. Data Processing & Analysis Core: A powerful application processor or microcontroller runs the
device's operating system, manages the user interface, executes
test standards (e.g., from IEC/TIA), stores results, and generates
clear pass/fail reports and graphical trace data. Multi-Interface Connectivity & Calibration Storage: The PCBA includes USB and often Wi-Fi/Bluetooth modules for data
transfer and remote control. It features non-volatile memory to
store crucial calibration coefficients for each laser and detector, ensuring measurement accuracy over
time and temperature changes. Advanced Power Management System: Employs a sophisticated PMIC to manage multiple internal voltage
rails efficiently. It supports long battery life for field use by
powering down high-current components (like lasers and displays)
when not in active use and facilitates stable operation from
various sources (battery, AC adapter, Power over Ethernet). Ruggedized Design & Environmental Compensation: The board is often conformally coated and designed with
wide-temperature-range components. It includes environmental
sensors (for temperature) to auto-compensate measurements, as fiber
attenuation and laser output can vary with ambient conditions.
FAQ Question 1: What is needed for a quotation?
Answer:
PCB: QTY, Gerber file, and Technical Requirements( material/surface
finish treatment/copper thickness/board thickness,...)
PCBA: PCB information, BOM,(Testing documents...)
Q2: What file formats do you accept for production?
Answer:
PCB Gerber file
BOM list for PCB
Test method for PCBA
Q3: Are my files safe?
Answer:
Your files are held completely safe and secure. We protect the IP
for our customers in the whole process. All documents from
customers are never shared with any 3rd parties.
Q4: What is the shipment method?
Answer:
We can offer FedEx /DHL / TNT / UPS for shipment. Also, customer
provided shipment method is acceptable.
Q5: What is the payment method?
Answer:
Telegraphic Transfer in advance (Advance TT, T/T), PayPal is
acceptable. PCB & PCBA Description | PCB Layers | 1-42 layers | | PCB Materials | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | | Maximum Board Size | 620mm × 1100mm | | Certification | RoHS Directive-Compliant | | Board Thickness | 1.6 ±0.1mm | | Outer Layer Copper Thickness | 0.5-5oz | | Inner Layer Copper Thickness | 0.5-4oz | | Maximum Board Thickness | 6.0mm | | Minimum Hole Size | 0.20mm | | Minimum Line Width/Space | 3/3mil | | Minimum Solder Mask Pitch | 0.1mm (4mil) | | Plate Thickness and Aperture Ratio | 30:1 | | Minimum Hole Copper | 20µm | | Hole Diameter Tolerance (PTH) | ±0.075mm (3mil) | | Hole Diameter Tolerance (NPTH) | ±0.05mm (2mil) | | Hole Position Deviation | ±0.05mm (2mil) | | Outline Tolerance | ±0.05mm (2mil) | | PCB Solder Mask Colors | Black, White, Yellow | | PCB Surface Finishes | HASL Lead-free, Immersion ENIG, Chemical Tin, Flash Gold, OSP, Gold
Finger, Peelable, Immersion Silver | | Legend Color | White | | Electrical Testing | 100% AOI, X-ray, Flying Probe Test | | Outline Processing | Routing and Scoring/V-cut | | Inspection Standard | IPC-A-610 Class II | | Certificates | UL (E503048), ISO9001, ISO14001, IATF16949 | | Outgoing Reports | Final Inspection, Electrical Test, Solderability Test, Micro
Section Analysis |
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