Rapid Thermal Shock Chambers Two-Zone, Minute Recovery Precise
Temperature ControlOur Rapid Thermal Shock Chambers are engineered to provide exceptionally fast and precise
temperature cycling for rigorous product reliability testing.
Featuring a two-zone design (hot and cold) and minute recovery times, these chambers are essential for evaluating the durability and
performance of components and assemblies under extreme and rapid
temperature changes. Ideal for industries requiring accelerated
stress testing, our chambers efficiently uncover design flaws and
potential failure points, ensuring your products withstand harsh
thermal environments. Key Features- Two-Zone Design: Utilizes physically separated hot and cold chambers, allowing for
near-instantaneous transfer of test samples between extreme
temperatures.
- Minute Recovery Times: Achieves specified hot and cold temperatures remarkably fast after
sample transfer, maximizing test efficiency and throughput.
- Rapid Temperature Change Rates: Capable of achieving extremely fast temperature transition rates,
simulating the most severe thermal shocks.
- Precise Temperature Control: Advanced control systems maintain accurate and uniform temperature
conditions within each zone, crucial for reliable testing.
- Automated Sample Transfer: Integrated mechanical lift system ensures smooth, repeatable, and
safe transfer of test articles between the hot and cold zones.
- Comprehensive Data Logging: Continuously records temperature profiles, transfer times, and
test cycles, providing a complete audit trail for analysis and
compliance.
- User-Friendly Interface: Intuitive touchscreen controls and software simplify test
programming, monitoring, and data export.
- Robust and Reliable Construction: Built with high-quality insulation and components for long-term
durability and energy efficiency during continuous operation.
- Safety Features: Equipped with multiple safety interlocks and alarms to protect
both the equipment and the test samples.
Applications- Electronics & Semiconductors: Thermal shock testing of integrated circuits, PCBs, sensors, and
electronic components to identify solder joint failures and
material fatigue.
- Automotive: Evaluation of electronic control units (ECUs), sensors, and
battery components for thermal stress resistance.
- Aerospace & Defense: Qualification of components for extreme operational temperatures
and rapid altitude changes.
- Materials Science: Assessing the thermal expansion, contraction, and fatigue
properties of new materials.
- Medical Devices: Durability testing of devices exposed to rapid temperature
variations.
- Consumer Products: Ensuring the reliability of products designed for fluctuating
thermal environments.
Benefits- Accelerated Stress Testing: Quickly reveals product weaknesses, helping to shorten development
cycles and time-to-market.
- Enhanced Product Reliability: Identifies potential failure modes related to thermal expansion
mismatch, material fatigue, and component degradation.
- Accurate Simulation: Precisely replicates real-world rapid temperature changes,
providing confidence in product performance.
- Increased Efficiency: Minute recovery times and automated transfer maximize testing
throughput.
- Reduced Rework & Warranty Costs: Proactive identification of design flaws prevents costly field
failures.
- Compliance & Validation: Provides reliable data for meeting industry standards and
regulatory requirements.
SpecificationsModel | TSC-49-3 | TSC-80-3 | TSC-150-3 | TSC-216-3 | TSC-512-3 | TSC-1000-3 | Inside dimension(W x D x H) cm | 40 x 35 x 35 | 50 x 40 x 40 | 65x 50 x 50 | 60 x 60 x 60 | 80 x 80 x 80 | 100 x 100 x 100 | Outside dimension(W x D x H)cm | 128x 190 x 167 | 138 x 196 x 172 | 149 x 192 x 200 | 158 x 220 x 195 | 180 x 240 x 210 | 220 x 240x 220 | Internal material | #304 Stainless Steel | External material | Powder coated #304 Stainless Steel | High temperature range | 60 ℃ ~ 200 ℃ | Low temperature range | 0 ℃ ~ -70 ℃ | Test temperature range | 60 ℃ ~ 180 ℃ / 0 ℃ ~ -70 ℃ | Temperature recovery time | 1-5min | Temperature stability ℃ | ±2 | Cylinder switching time | 10s | High temperature ℃ | 150 | 150 | 150 | 150 | 150 | 150 | Heating time (min) | 20 | 30 | 30 | 30 | 30 | 30 | Low temperature | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | -40, -50, -65 | Cooling time (min) | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | 40, 50, 60 | Air circulation system | Mechanical convection system | Cooling system | Imported compressor, fin evaporator, gas condenser | Heating system | Fin heating system | Humidification system | Steam Generator | Humidification water supply | Reservoir, Sensor-controller solenoid valve, recovery-recycle
system | Controller | Touch panel | Electrical power requirements | 3 phase 380V 50/60 Hz | Safety device | Circuit system load protection, compressor load protection, control
system load protection, humidifier load protection, overtemperature
load protection, fault warning light |
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