TIF100-11S Silicone Thermal Pad Thermal Gap Pad
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TIF®100-11S Silicone thermal pad thermal gap pad
The TIF®100-11S series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> RoHS compliant
Products Size: 8"*16"(203mm*406mm) Peressure Sensitive Adhesive: Request adhesive on one side with "A1" suffix. Request adhesive on double side with "A2" suffix. Reinforcement: TIF series sheets type can add with fiberglass reinforced. Company Profile
Vietnam Ziitek Technology Company Limited is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
FAQ:
Q: Are you trading company or manufacturer ? A: We are manufacturer in Vietnam. Q: How long is your delivery time? A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity. Q: Do you provide samples ? is it free or extra cost? A: Yes, we could offer samples free of charge. |
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