HRF535-02N Nitrogen Oven for Ceramic Drying
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Detailed Product Description
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Product Specifications Chitherm HRF535-02N Nitrogen Oven is widely used in processes such
as drying and curing of electronic products and other items under
constant temperature and oxygen-free environments.
Product Description Applications Primarily designed for binder burning out (BBO) under oxygen-free processes for electronic components and ceramic substrates. Technical Specifications Rated Temperature: 200ºC Maximum Temperature: 300ºC Effective Dimensions: 800 × 800 × 800mm (W×H×D) Heating Method: Customized Heater Process Atmosphere: Nitrogen Temperature Control Stability: ±1ºC with PID parameter self-tuning Temperature Uniformity: ±3ºC (after 1 hour insulation at 200ºC) Thermocouple: Type K Temperature Control Points: 1 Temperature Monitoring Points: 1 Process Steps: 20 steps Exhaust System: Top-mounted exhaust port Alarm System: Sound and light alarms for over-temperature and
thermocouple failure Maximum Heating Power: 10kW Insulation Power: ≤ 5kW Surface Temperature Rise: ≤ 35ºC Weight: Approximately 700kg Furnace Dimensions: 1550×1630×1050mm (W×H×D) Appearance Color: Light gray Delivery Contents
Facility Requirements Environmental conditions: Temperature 0-40ºC, humidity ≤80% RH, no
corrosive gas, no strong airflow disturbance Process air conditions: 99.999% purity nitrogen, pressure
0.2-0.4Mpa, gas consumption 5-15m³/h Ventilation system: Non-contact access to user pumping system with
capacity >15m³/h Ground requirements: Level surface, no vibration, bearing capacity
>300Kg/m² Power conditions: >14kVA capacity, 3-phase 5-wire, 220/380V,
50Hz Installation space: 2500mm×2100mm×3000mm (W×H×D), area >5m² Product Images |
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