5:1 Mixing Ratio Epoxy Glue Potting Machine with 220V Power and Precision Ratio Control for Water Pump Assembly

5:1 black epoxy glue potting machine for water pump assembly glue automatic injection

The 5:1 black epoxy glue potting machine is engineered for high-precision encapsulation in water pump assembly manufacturing, combining robust sealing performance with production-line adaptability. Optimized for waterproofing in submerged pump applications.

• Precision ratio control: Automated dual-component metering system ensures accurate 5:1 epoxy resin-hardener mixing (±1% deviation) for consistent viscosity and bubble-free encapsulation
• Industrial-grade durability: Reinforced stainless-steel dispensing head withstands abrasive filler-loaded epoxy compounds, maintaining high repeatability across cycle running for pump housing and impeller potting
• Adaptive programming: Multi-axis robotic arm with path memory function accommodates diverse pump geometries, achieving high percentage coverage accuracy for critical sealing areas like shaft couplings

• Metering, proportion, mixing, dispensing are realized via automatic operation
• Two 304 stainless steel containers to store A glue and B glue separately to prevent solidification during long-term reservation
• 3-axis mechanical hands employ high precision linear movement module to ensure accurate movement and high repeat accuracy
• Touch screen operation plus handheld teaching programming case, easy to learn and operate
• Customizable fixture and glue delivery head according to product features and production capacity requirements