High Pressure Automatic Pneumatic Stencil Cleaner with 4-Stage
Filtration System – 360° Rotary Spray for Stencil, Misprint PCB
Board & Scraper Cleaning Product Introduction - The Pneumatic Stencil Cleaner is designed for the SMT (Surface
Mount Technology) production line. It efficiently removes solder
paste, red glue, flux, and other high‑viscosity residues from:
- SMT stencils (laser‑cut, step, and frameless)
- Misprinted PCB boards
- Squeegees / scrapers (metal or polyurethane)
- Copper screens, fixtures, pallets, and tooling
- By operating entirely on compressed air, the machine eliminates
electrical ignition risks, making it ideal for environments where
safety is paramount.
Key Applications - SMT laser stencils / step stencils
- Misprinted PCB assemblies
- Printing squeegees (metal or rubber)
- Copper screens and silk screens
- Wave solder pallets, fixtures, and carriers
- Components with residual high‑viscosity adhesives
Technical Specifications Applicable steel mesh sizeb: | L750 × W750 × H40 (mm) [Extra large sizes need to be customized] | Overall dimensions : | L1000×W700×H1730 (mm) | Liquid tank maximum capacity | 40 liters | Optimum liquid usage | 30 liters | Cleaning method: | 360°rotating double-sided isobaric spray roll high-pressure spray
(cleaning + drying) | Cleaning time | 2-5min(for reference only) | Drying time | 2-5min(for reference only) | External air source | 0.4~0.7 (Mpa) | Air consumption | 400~600(L/Min) | Exhaust port size | Φ125×H25(mm) | Filtration system (first level) | First level filter: (filters impurities and labels) | Filtration system (secondary) | Secondary filter: (filters solder paste and rosin particles) | Filtration system (three levels) | Third level filter: 5㎛ filter element (filters solder paste and
rosin particles) | Machine net weight: | about 210Kg |
Machine Details Key Features - Fully Pneumatic Drive – No electrical connection required;
powered solely by compressed air.
- 360° High‑Pressure Rotary Spray – Ensures thorough cleaning of
stencil apertures, PCB surfaces, and complex tooling.
- Multi‑Stage Filtration System – Integrated 4‑stage filtration
separates solder particles and contaminants, extending cleaning
fluid life.
- Versatile Solvent Compatibility – Works with IPA, water‑based
cleaners, and solvent‑based solutions.
- One‑Button Automatic Cycle – Combines washing, rinsing, and drying
in a fully automatic sequence.
Applicable Industries - Electronics Manufacturing Services (EMS)
- Consumer electronics (smartphones, tablets, home appliances)
- Automotive electronics (PCBs requiring high reliability)
- Medical device manufacturing (strict cleanliness standards)
- Aerospace & defense (explosion‑proof environments)
- SMT contract manufacturers
- Semiconductor packaging (post‑solder‑printing cleaning)
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