China Pick And Place Machine manufacturer
Shenzhen Hongxinteng Technology Co., Ltd.
2
Home > Products > Electronics Production Machinery >

Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting

Browse Categories

Shenzhen Hongxinteng Technology Co., Ltd.

City: shenzhen

Country/Region:china

Tel:+86-16620793861

Contact Person:
Miss.Alina View Contact Details

Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting

  • 1
  • 2
  • 3
  • 4
Minimum Order Quantity 1
Price $28,000-28,500
Brand Name GKG
Certification ce
Place of Origin China
Payment Terms T/T
Supply Ability 50
Delivery Time 20day
Packaging Details Vacuum Wooden Box Packaging
Weight 1200KG
Cycle Time 150ms
Die Dimensions 0.076mm*0.076mm-2mm*2mm
Name Flip Chip Die Bonder Machine
Application LED Chip Manufacturing
Type SMT Production Line
Detailed Product Description
Fully Automatic High Precision Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Machine Features
  • Front-loading and rear-loading methods, compatible with docking station for improved operator efficiency and production cycle time
  • Internationally leading dual die bonding, dual dispensing, and dual wafer search systems
  • Direct-drive motor for bonding head operation
  • Linear motor driven wafer search platform (X/Y) and feed platform (B/C)
  • Automatic angle correction system for wafer frame
  • Automatic wafer ring loading/unloading system for enhanced production efficiency
  • Precision automation ensures improved production efficiency and reduced operational costs
Technical Specifications
Production Cycle150ms (depends on chip size and bracket)
XY Accuracy±1mil (±0.025mm)
Die Rotation±3°
Die XY Workbench
Die Dimensions3mil*3mil-80mil*80mil (0.076mm*0.076mm-2mm*2mm)
Max. Angle Correction±15°
Max. Die Ring Size6″ (152mm) outer diameter
Max. Die Area4.7″ (119mm) after expansion
Resolution Ratio0.04mil (1μm)
Thimble Z Height Stroke80mil (2mm)
Image Recognition System
Grey Scale256 (Level Grey)
Resolution720(H)*540(V)(Pixels)
Die Bonder's Swing Arm-and-hand System
Swing Arm of Die Bonder105° rotatable die bonding
Die Bond PressureAdjustable 30g-250g
Loading Workbench
Range of Stroke500mm*120mm
XY Resolution0.02mil (0.5μm)
Suitable Holder's Size
Length300mm-500mm
Width80mm-120mm
Facilities Needed
Voltage/Frequency220V AC±5%/50HZ
Compressed Air0.5MPa (MIN)
Rated Power1200W
Gas Consumption40L/min
Volume and Weight
Dimensions (L*W*H)1900*980*1620mm
Weight1200KG
Frequently Asked Questions
Is this machine easy to operate for first-time users?

An English manual and guide video are provided to demonstrate machine operation. For additional questions, contact us via email, Skype, phone, or our online trade manager service.

What if the machine has problems after delivery?

We provide free replacement parts during the warranty period. For parts under 0.5KG, we cover postage; for heavier parts, the customer pays shipping.

What is the minimum order quantity?

Minimum order is 1 machine, and mixed orders are welcome.

How can I purchase this machine?
  1. Consult with us online or via email
  2. Negotiate and confirm final price, shipping, and payment terms
  3. Receive and confirm proforma invoice
  4. Make payment as specified
  5. We prepare your order after full payment confirmation
  6. 100% quality check before shipping
  7. Delivery by air or sea
Why choose our company?
  1. We are the actual manufacturers
  2. Over ten years of experience in the machine industry
  3. Commitment to high quality and timely delivery
  4. 24-hour after-sales support
Product Tags: High‑Precision Flip Chip Die Bonder   Flip Chip Die Bonder Machine   Die Bonder Machine SMT Production Line  
Related Products
Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal for sale

Explosion-Proof Pneumatic Stencil Cleaner SMT Stencil Cleaning Machine For PCB Solder Paste & Glue Removal

Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting for sale

Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting

20W 30W 50W Fiber Laser Marking Machine with Rotary System and EZCAD Software for Metal Jewelry Engraving for sale

20W 30W 50W Fiber Laser Marking Machine with Rotary System and EZCAD Software for Metal Jewelry Engraving

30W 50W 60W CO2 Laser Engraver for Non Metal Cutting with High Precision Marking on Wood Acrylic Leather Fabric for sale

30W 50W 60W CO2 Laser Engraver for Non Metal Cutting with High Precision Marking on Wood Acrylic Leather Fabric

Automatic Offline PCBA Cleaning Machine SME-5600 Industrial PCB Flux Removal Water Based Batch Washer for sale

Automatic Offline PCBA Cleaning Machine SME-5600 Industrial PCB Flux Removal Water Based Batch Washer

LED Light Testing Machine DOB Light Source Test Machine PCB LED light Detection Equipment for sale

LED Light Testing Machine DOB Light Source Test Machine PCB LED light Detection Equipment

Email to this supplier
 
From:
Enter your Email please.
To: Shenzhen Hongxinteng Technology Co., Ltd.
Subject:
Message:
Characters Remaining: (80/3000)
 
Home | Products | Suppliers | About Us | 公司概况
Terms of user - Intellectual Property Rights (IPR) Protection Policy - Privace Policy
Copyright © 2011-2026 everychina.com.cn. All rights reserved.