PCB AOI(Automated Optical Inspection)Machine Inspection of Printed Circuit Board Equipment For PCB Circuit Boards Manufacturing 

Description

Designed specifically for detecting circuit defects on various rigid PCB boards after etching, this system integrates multiple intelligent modules, including automatic loading and unloading, selectable upper and lower light sources, Gerber file/photo comparison detection, defect coding and marking, and an intelligent repair station.

The equipment ensures zero missed detection of serious defects, significantly improving production accuracy and efficiency. One machine can replace six manual inspection positions, and a single operator can manage multiple devices simultaneously, enabling highly efficient and intelligent production.

Specifications

 Dual Mode Selection: Gerber File Comparison And Photo Comparison

1. Gerber File Comparison Mode: Supports direct import of Gerber files, utilizing proprietary parsing and AI deep learning for intelligent comparison. The process is easy to operate and quickly mastered.

2. Photo Comparison Mode: Allows users to take photos and independently set comparison templates. It supports manual positioning and the ability to mask non-detection areas, providing flexibility to adjust the inspection strictness based on actual settings.

Perfect For Aluminum, Single-Sided, Fiberglass, Acrylic, And All Types Of Flat Rigid Substrates

Independently Select Top and Bottom Light Sources Based on Material CharacteristicsThe system automatically detects the substrate size and calculates the optimal parameters for image capture, ensuring the best results. It also provides real-time defect detection and comparison with the template.

Share Defect Data With Intelligent Repair Station For Fast Defect Location

Each device is equipped with an intelligent repair station, sharing defect location data in real-time. Repair technicians can quickly locate defects through coding and on-screen displays, ensuring efficient and precise repairs.

Applications:

1. PCB manufacturing
Core Applications: directly used in the Solder Mask coating process in PCB manufacturing.
Function: precise alignment is realized by CCD vision system to ensure the accuracy of solder mask printing and avoid pad coverage or offset.
Advantages: improve yield, suitable for high density, multi-layer, small pad PCB (such as HDI board, FPC) .

2. Consumer Electronics
Application scenarios: smart phones, tablets, laptops and other equipment PCB production.
Demand: consumer electronics products tend to thin, high-precision solder mask process to prevent short circuit, to ensure the reliability of micro components welding.

3. The automotive electronics industry
Application scenarios: on-board control systems, sensors, New Energy Vehicle Battery Management System PCB manufacturing.
Requirements: Automotive Electronics Need High Temperature Resistance, anti-vibration, solder mask quality directly affects the long-term stability, CCD alignment guarantee consistency.

4. Communications equipment industry
Application scenarios: 5G base stations, routers, optical fiber equipment and other high-frequency high-speed PCB production.
Requirements: high frequency PCB has strict requirements for impedance control, solder mask thickness and accuracy Signal integrity.

5. The medical device industry
Application: PCB manufacturing of medical imaging equipment, portable monitor and other precision instruments.
Requirements: Medical PCB requires high reliability, solder mask defects may cause equipment failure, CCD system reduces human error.

6. Industrial control and automation
Application Scenario: PCB production of PLC, industrial robot and motor driver.
Requirements: Harsh Industrial Environment, solder mask to corrosion resistance, anti-aging, precision printing to extend equipment life.

7. Aerospace and defense
Application Scenarios: PCB manufacturing for satellites, avionics systems, and military equipment.
Requirements: Reliability in extreme environments, CCD technology ensures accurate solder mask coverage on complex pcbs.

8. Semiconductor package
Extended applications: some advanced packaging processes (e. g. , substrate-level packaging) may require similar solder mask techniques to protect microwires.