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Global Soul Limited
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SMT Pick And Place Machines Sony SI-F209

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Global Soul Limited

City: shenzhen

Country/Region:china

Tel:86-755-27962186

Contact Person:
Mr.Yi Lee
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SMT Pick And Place Machines Sony SI-F209

Brand Name Sony
Model Number SI-F209
Place of Origin Japan
Minimum Order Quantity 1 PCS
Price USD+negotiable+pcs
Payment Terms T/T
Supply Ability 1+pcs+per days
Delivery Time 1-7 days
Packaging Details 1350*1850*1650mm
Model Sony SI-F209
Substrate size 50mm*50mm-460mm*360mm
Substrate thickness 0.5mmto2.6mm
Number of mounting heads 1 head 6 nozzles
Mounting range 2012(0804)-32mmIC
Component Height max 7mm Mobile Camera Fixed Camera 25mm
Mounting speed 0.49sec(7350CPH)
Mounting accuracy 60um (CPK1.0 or above) chip)
Power supply AC3-phase 200V±10% 50/60HZ
Power consumption 2.3kw
Gas consumption 0.49MPA 100L/min
Appearance size 1220mm*1700mm*1573mm
Weight 1800KG
Machine Size 1220*1700*1588mm
Detailed Product Description

Description:
Enhance your PCB assembly with the Sony SI-F209, a cutting-edge SMT mounter renowned for its precision and high-speed capabilities. ●With a robust modular design that allows for rapid reconfiguration, this machine is an ideal solution for electronics manufacturers seeking to maximize productivity and reduce placement costs. ●It boasts an adaptable feeder system capable of handling a diverse array of components, ensuring seamless integration into any SMT line. ●The SI-F209's advanced vision system guarantees exact alignment and placement, driving efficiency even for complex boards. ●Rely on Sony's innovation to meet the demanding standards of modern SMT production with this versatile mounter.



Electronic Part Mounter SI-F209:

1.Supports large, odd-shaped parts
The unit is equipped with a multifunction head that is capable of mounting parts ranging from size 2012 to φ150mm.The unit also automatically corrects the pick up position on the parts to improve the pick up rate.


2.Reduces loss in tact time
To increase productivity, the unit features flying vision and flying nozzle change functions,which respectively perform parts recognition and nozzle changes,while the head is in motion after picking up or placing parts.


3.Coplanarity system*
This system inspects leads and solder balls of the large parts such as QFP and BGA.


4.Dip Unit*
This is a flux and solder paste coating unit for POP mounting.Coating material is supplied automatically.


5.PDX(Product Explorer)*
Receives and distributes production data and performs device management at will. lmproves your productivity, traceability and quality levels through remote machine control.


6.CPS Pro 4*
This software optimizes the layout of nozzles and parts supply on all the Sl series. Equipped with the same GUl as the unit's display, it is even easier to use.

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