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Custom Electronic Design Manufacturing Assembly-Mobile Phone Charger Power Bank PCB PCBA Control Board Specification: | Quality Standard | IAFT 16949 Tier 1 Manufacturer | | | Traceability | QR Code Laser printing in MES system | | | Max Stencil Size | 1560mm*450mm | | | Min SMT Package | 0201 | | | Min IC Pitch | 0.3mm | | | Max PCB Size | 1200mm*400mm | | | Min PCB Thinkness | 0.35mm | | | Min Chip Size | 01 005 | | | Max BGA Size | 74mm*74mm | | | BGA Ball Pitch | 1.0-3.00 | | | BGA Ball Diameter | 0.2 - 1.0mm | | | QFP Lead Pitch | 0.2mm-2.54mm | | | SMT Capacity | 6 million points per day | | | Change Line Time | Within 30 minutes | | | DIP Capacity | Automatic Wave soldering, 6000 sets per day | | | dispensing | Selective dispensing | | | Conformal coating | Automatic coating | | | Test | AOI, IC programming, ICT, FCT,Function test | | | Aging | High temperature, Low Temperature | | | Conformal coating | Automatic coating | | | Housing | Automatic assembly line,Automatic screw | | | PCB Specification | FR-4,1.6mm tickness,1OZ,2-10Layer HDI stackup,HASL-LF | | Processor | ARMCortex-M4,168MHz | | Memory | 128KBRAM,512KBFlash,MicroSD slot(up to32GB) | | Power Consumption | 3.3V,<1μA static,<30mA dynamic | | Connectivity | Wi-Fi,BLE 4.2 Ethemet(10/100Mbps) | | I/OInterfaces | 32GPIO.6ADC(12-bit).8PWM.12C,SP1.UART | | Signal Processing | 0-3.3V analog input,DSP instructions | | Temperature Range | -40°Cto+85°operating,-40°Cto+125Cstorage | | Physical Size | 50mm×30mm×2mm | | Development Environment | C,C++,Python,Arduino IDE,PlatformlO | | Security Features | AES-128,SHA-256,SecureBootTamper-proofdesign | | Certifications | RoHS | | Additional Features | Deepsleepmode,RTC with battery back up,built-in Additional Features
temperature/humidity sensor,expansion header pins | |
