Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

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guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:86-13823313140

Contact Person:
Mr.Leonard View Contact Details

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Brand Name	Jietai
Model Number	JTM-100504AD
Certification	CE, FCC, ROHS, etc.
Place of Origin	Dongguan, Guangdong
Minimum Order Quantity	1
Price	￥800000
Payment Terms	T/T
Supply Ability	One unit. It will take 30 to 60 days.
Delivery Time	30-60work days
Packaging Details	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Cleaning Frequency	40KHZ/80KHZ
Type	Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing
Name	Semiconductor Cleaning Machine
Cleaning temperature	60℃
Overall Dimensions	12M2M2.8M
Model	JTM-100504AD
Number of Tanks	10
Power	120KW

Detailed Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaning System

Tailored for high-precision semiconductor manufacturing, this integrated cleaning system combines multi-stage ultrasonic processes to deliver sub-ppb level surface purity, a critical prerequisite for silicon wafer fabrication in advanced node (≤7nm) microelectronics production.

Stage-by-Stage Cleaning Mechanism:

Ultrasonic Alkaline Cleaning: Operates at 40KHz-80KHz to generate controlled cavitation in alkaline media, efficiently stripping organic contaminants (e.g., photoresist, hydrocarbons) and particulate matter (≥1μm) from wafer surfaces and patterned structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafers, including edge bevels and backside surfaces.

Ultrasonic Acid Cleaning: Utilizes the same frequency range in acidic solutions to target inorganic impurities—specifically metal ion contaminants (Fe, Cu, Zn) and native oxide layers (SiO₂). This stage employs cavitation-induced micro-jets to dislodge sub-100nm particles embedded in trenches or vias, validated by laser particle counters (≤5 particles/wafer for ≥0.1μm).

Pure Water Rinse Cycle: Final rinse with UPW (ultra-pure water, TOC ≤3ppb) eliminates residual chemistries, achieving surface resistivity ≥18.2MΩ·cm to meet SEMI F020 standards for pre-deposition processing.

Technical Specifications:

Ultrasonic Frequency Band: 40KHz-80KHz (multi-frequency selectable via PLC, optimizing cavitation intensity for contamination type)

Process Temperature: 60℃ (PID-controlled, ±0.5℃ tolerance) to accelerate chemical reactivity without inducing wafer stress

Material Compatibility: Wetted components in PFA and high-purity alumina to resist HF/H₂SO₄ corrosion, preventing particle shedding

Core Performance Metrics:

Particle Removal Efficiency (PRE) ≥99.9% for ≥0.1μm contaminants

Chemical residue elimination ≤0.1ng/cm² (ICP-MS verified)

Compatible with automated cassette handling (FOUP/SMIF) for 24/7 fab integration

Application: Essential for pre-litho, post-CMP, and pre-implant cleaning in logic, memory, and sensor wafer production lines.

Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, UPW rinsing, 40-80KHz, 60℃ process, silicon wafer decontamination

This system ensures consistent cleaning performance to maximize yield in high-volume semiconductor manufacturing environments.

Product Tags: Semiconductor silicon wafer ultrasonic cleaner Alkaline acid cleaning wafer machine 60℃ pure water rinsing cleaner

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