40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

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guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:86-13823313140

Contact Person:
Mr.Leonard View Contact Details

40KHz-80KHz Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Brand Name	Jietai
Model Number	JTM-100504AD
Certification	CE, FCC, ROHS, etc.
Place of Origin	Dongguan, Guangdong
Minimum Order Quantity	1
Price	￥800000
Payment Terms	T/T
Supply Ability	One unit. It will take 30 to 60 days.
Delivery Time	30-60work days
Packaging Details	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Number of Tanks	10
Cleaning temperature	60℃
Power	120KW
Cleaning Frequency	40KHZ/80KHZ
Overall Dimensions	12M2M2.8M
Model	JTM-100504AD
Name	Semiconductor Cleaning Machine
Type	Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing

Detailed Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaner

This high-performance cleaning system is specifically designed for semiconductor silicon wafer processing, integrating multi-stage ultrasonic technologies to achieve the ultra-high surface purity required for advanced microelectronics manufacturing, directly influencing device yield and reliability.

Comprehensive Cleaning Process:

Ultrasonic Alkaline Cleaning: Utilizes 40KHz-80KHz ultrasonic energy in an alkaline solution to effectively remove organic contaminants, photoresist residues, and larger particulate matter from silicon wafer surfaces and intricate structures. The ultrasonic cavitation effect ensures thorough cleaning even in narrow gaps and patterned areas, preparing the wafers for subsequent acid cleaning.

Ultrasonic Acid Cleaning: Employs the same adjustable frequency range in an acidic medium to target and eliminate inorganic impurities, including metal ions (such as Fe, Cu, Ni) and oxide layers. This stage further enhances surface purity by dislodging submicron contaminants that may be embedded in the wafer's texture, leveraging the precise ultrasonic energy to avoid damaging the wafer surface.

Pure Water Rinsing: The final stage uses high-purity water with resistivity ≥18.2MΩ·cm to thoroughly rinse away residual cleaning agents, ensuring the wafer surface is free from any chemical residues. This step is crucial for maintaining the wafer's surface integrity and meeting the strict purity standards required for subsequent processes like thin-film deposition and lithography.

Key Technical Parameters:

Ultrasonic Frequency: 40KHz-80KHz, which is adjustable to adapt to different contamination types and wafer specifications, allowing for optimal cavitation intensity and cleaning efficiency.

Operating Temperature: 60℃, a precisely controlled temperature that enhances the reactivity of the cleaning solutions while ensuring the silicon wafers remain structurally stable, preventing any potential thermal damage.

Material Construction: Critical components in contact with the wafers and cleaning fluids are made from corrosion-resistant materials such as PFA and high-purity quartz, effectively avoiding secondary contamination and ensuring long-term stable operation of the equipment.

Outstanding Advantages:

Delivers exceptional particle removal efficiency, capable of eliminating particles as small as 0.1μm, meeting the stringent requirements of semiconductor industry standards (SEMI) for advanced node manufacturing.

The combination of ultrasonic alkaline cleaning, ultrasonic acid cleaning, and pure water rinsing forms a complete and synergistic cleaning cycle, ensuring comprehensive removal of various contaminants from the wafer surface.

The adjustable frequency range (40KHz-80KHz) and stable 60℃ operating temperature allow for flexible customization according to specific wafer cleaning needs, making it suitable for a wide range of silicon wafer types and processing requirements.

Designed for seamless integration into semiconductor production lines, compatible with automated wafer handling systems to streamline the manufacturing process and reduce manual intervention, improving overall production efficiency.

Application Scope: Ideal for cleaning silicon wafers in 4-inch to 12-inch semiconductor manufacturing processes, including pre-diffusion, pre-lithography, post-etching, and pre-metallization stages, widely used in both research and development laboratories and large-scale production facilities.

Keywords: Semiconductor silicon wafer cleaner, ultrasonic alkaline cleaning, ultrasonic acid cleaning, pure water rinsing, 40KHz-80KHz, 60℃, surface treatment, microelectronics manufacturing

Product Tags: semiconductor silicon wafer cleaner ultrasonic alkaline acid cleaning machine 60℃ pure water rinsing cleaner

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