Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

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guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:86-13823313140

Contact Person:
Mr.Leonard View Contact Details

Semiconductor Silicon Wafer Cleaner - 40KHz-80KHz Ultrasonic Alkaline/Acid Cleaning + Pure Water Rinsing, 60℃

Brand Name	Jietai
Model Number	JTM-100504AD
Certification	CE, FCC, ROHS, etc.
Place of Origin	Dongguan, Guangdong
Minimum Order Quantity	1
Price	￥800000
Payment Terms	T/T
Supply Ability	One unit. It will take 30 to 60 days.
Delivery Time	30-60work days
Packaging Details	Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M2M2.8M
Type	Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing
Cleaning Frequency	40KHZ/80KHZ
Number of Tanks	10
Power	120KW
Overall Dimensions	12M2M2.8M
Model	JTM-100504AD
Name	Semiconductor Cleaning Machine
Cleaning temperature	60℃

Detailed Product Description

Product Introduction: Semiconductor Silicon Wafer Cleaner

Specifically engineered for the semiconductor industry, this high-precision cleaning equipment integrates multi-stage ultrasonic processes to achieve ultra-clean surfaces on silicon wafers, a critical prerequisite for ensuring high yield and reliability in microelectronic device manufacturing.

Core Cleaning Processes:

Ultrasonic Alkaline Cleaning: Leverages ultrasonic cavitation in alkaline solutions to efficiently remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces and microstructures. The controlled energy generated by ultrasonic waves ensures thorough cleaning even in intricate patterns, preparing wafers for subsequent acid treatment.

Ultrasonic Acid Cleaning: Utilizes ultrasonic energy in acidic media to target and eliminate inorganic impurities, including metal ions (such as Fe, Cu, and Ni) and oxide layers. This stage further enhances surface purity by dislodging submicron contaminants that may be embedded in wafer textures, leveraging the frequency-adjustable ultrasonic action for precise cleaning.

Pure Water Rinsing: The final stage employs high-purity water (with resistivity ≥18.2MΩ·cm) to thoroughly rinse away residual cleaning agents, ensuring the wafer surface is free from chemical residues and meets the strict purity standards required for advanced semiconductor processing.

Technical Parameters:

Ultrasonic Frequency Range: 40KHz-80KHz, which is adjustable to adapt to different contamination types and wafer specifications, optimizing cavitation intensity for optimal cleaning results.

Operating Temperature: Maintained at 60℃, a temperature that enhances the reactivity of cleaning solutions while preventing any potential damage to the silicon wafers, ensuring consistent and reliable cleaning performance.

Material Construction: Key components in contact with wafers and cleaning fluids are made of corrosion-resistant materials such as PFA and high-purity quartz, avoiding secondary contamination and ensuring long-term stability of the equipment.

Key Advantages:

Delivers exceptional particle removal efficiency, effectively eliminating particles as small as 0.1μm to meet the stringent requirements of semiconductor manufacturing standards (SEMI).

The combination of ultrasonic alkaline cleaning, ultrasonic acid cleaning, and pure water rinsing forms a complete cleaning cycle, ensuring comprehensive removal of various contaminants.

The adjustable frequency range (40KHz-80KHz) and precise temperature control (60℃) allow for customization according to specific wafer cleaning needs, enhancing process flexibility.

Designed for easy integration into semiconductor production lines, compatible with automated wafer handling systems to streamline manufacturing workflows.

Application: Ideal for cleaning silicon wafers in processes such as pre-lithography, post-etching, and pre-deposition in 4-inch to 12-inch wafer fabrication, suitable for both research and development and mass production environments.

Keywords: Semiconductor silicon wafer cleaner, ultrasonic alkaline
cleaning, ultrasonic acid cleaning, pure water rinsing,
40KHz-80KHz, 60℃, wafer surface treatment​

Product Tags: semiconductor silicon wafer cleaner ultrasonic alkaline acid cleaning machine pure water rinsing semiconductor cleaner

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