3.0 W/M·K Thermal Conductivity Compound For Electronics Two Components Silicone Electronic Control Modules Sensor
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3.0 W/M·K Thermal Conductivity Compound For Electronics Two Components Silicone Electronic Control Modules Sensor
RTV 2 Addition potting compound HN-8830A/B is a two-component
addition type organic silicone with low viscosity and 1:1 mixed ratio, excellent
thermal conductivity and good fluidity, which can be cured at room temperature or by
heating, and meanwhile be cured in a wide temperature range (It maintains rubber
elasticity within 40-200℃).It enjoys both good high temperature resistance,
endowing with excellent insulation properties, good waterproof, moisture-proof
and anti-aging properties.
Product Features for Thermally Conductive Potting Compound: 1. Good high temperature resistance 2. Anti-aging resistance 3. Excellent insulation properties, 4. Wide temperature range (-40℃-200℃), 5. Waterproof and moisture-proof
Technical Parameters for Thermally Conductive Potting Compound: Mix Ratio: 1:1 (A:B) Viscosity: 5000–8000 cP Pot Life (25°C): 1–2 hours Cure Time (25°C): 2–4 hours Hardness: 45–50 Shore A Flame retardant rating (V) (UL94):V-0
Applications for Thermally Conductive Potting Compound: Fields such as new energy vehicles (including battery management systems and electronic control modules), communication equipment, LED lighting, power modules, and various sensors and optoelectronic devices.
Handling Guide for Thermally Conductive Potting Compound: 1. Weighing: Accurately weigh components A and B and mix thoroughly
in a 1:1 (mixed) ratio. (Before weighing, group A and B should be.Stir the parts thoroughly
and evenly, so that the settled filler can be evenly dispersed into the glue liquid to
avoid affecting the colloid performance). 2. Mixing glue: Mix the glue material thoroughly and evenly by hand
or machine to make the glue material uniform in color. Manual mixing It should be noted
that the amount of glue added at one time should not be too much, so as not to reduce the
fluidity and make it difficult to fill the glue later. 3. Degassing: Place the evenly mixed rubber material in a vacuum
cabinet for degassing, and use vacuuming to remove air during the mixing process. 4. Potting: Fill the glue with all bubbles removed into the device
to complete the potting operation (the surface of the device before potting and the mixing
Containers should be kept clean and dry). 5. Curing: Heat and cure the potted device at room temperature. The
viscosity of the mixed colloid will gradually increase over time.Gradually increase,
attention should be paid to finish the potting within the appropriate operating time
Important Notes for Thermally Conductive Potting Compound:
Packaging & Storage for Thermally Conductive Potting Compound:
FAQ for Thermally Conductive Potting Compound: Q: Is it suitable for high-voltage applications? Q: Can I use it for potting transformers? Q: Does it resist yellowing? Q: What is the thermal conductivity? Q: Is it flame retardant? about us |
| Product Tags: 3.0 W/mK thermal compound for electronics two-component silicone potting compound thermal conductive compound for control modules |
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3.0 W/M·K Thermal Conductivity Compound For Electronics Two Components Silicone Electronic Control Modules Sensor |
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Thermal Conductive Silicone For Electronics High Thermal Conductivity 2.0w/M·K Silicone Potting Compound Potting Factory Direct Supply |
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HN-8830 Potting Compound - 3.0 W/MK Thermal Conductive Silicone For Extreme Environment Electronics |
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Electronics Potting Compound | HN-8820 | 2.0 W/M·K | Waterproof & Anti-Aging |
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HN-8820 A/B Silicone Potting | High Insulation | 2.0 W/M·K | Fast Curing |
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Low Viscosity Potting Gel HN-8820 | 1:1 Mix | 2.0 W/M·K | Moisture Resistant |