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Electrical Epoxy Potting Material Black Clear High-Temperature Epoxy Potting Adhesive Potting Compound For Led Driver Power Module

Electrical Epoxy Potting Material Black Clear High-Temperature Epoxy Potting Adhesive Potting Compound For Led Driver Power Module

Brand Name Hanast
Model Number HN-5508A/B
Certification ROHS,SGS
Place of Origin Guangdong, China
Minimum Order Quantity 1 kilogram
Price Negotiable
Payment Terms T/T, D/A, D/P
Delivery Time 5-7days
Packaging Details 25KG/ Iron Drum
Name Flexible Epoxy Potting Compound
Color Black,clear
Curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
Mix ratio A: B =5:1 (weight ratio)
Resistance to the voltage of kv/mm 20-22
Hardness 85-95 shore D
Feature flame retardant insulation
Application transformers, resistors, filters, temperature sensors
Shelf time 6month
Tensile strength of kg/cm 16-18
Detailed Product Description

Electrical Epoxy Potting Material Black Clear High-Temperature Epoxy Potting Adhesive Potting Compound For Led Driver Power Module

Product description of Epoxy Potting Adhesive

Epoxy potting compound is a liquid polymer material primarily composed of epoxy resin, along with curing agents, fillers, and functional additives. It is used in fields such as electronic components and precision instruments to provide insulation, sealing, moisture resistance, dust protection, and shock resistance. After curing, it forms a hard, high-performance insulator and is widely used in the electronics, automotive, and new energy industries.

Product features of Epoxy Potting Adhesive
Electrical insulation, waterproofing and moisture resistance, dustproof, corrosion resistance, high and low temperature resistance, vibration resistance, improved mechanical strength, and confidentiality.

 

 


 

Physical Properties of epoxy potting adhesive

efore curingbuilderEpoxy resin 5508Curing agent 5508
pigmentBlack / White et alRuburn / transparent surface
 A sticky epoxy resin waterr liquid specific
c gravity, g / cm31.4-1.51.05
Viscosity of 25℃4,500—6,000cp s150—250cp storage
e Period (25℃)Six monthsx months

 

processabili

 

mixing ratioA: B =5:1 (weight ratio)
Available for a time of 25℃2-3H (100g mix)
curing time25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing2 Tensile strength of kg/cm16-18
2 Compressive strength of kg/cm18-22
Resistance to the voltage of kv/mm20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage%0.35-0.55
Water absorption rate was 25℃ * 24H<0.03%

 

The hardness of SHORE A85-95

distortion

temperature ℃

130-150
low temperature resistant ℃-30

 
 

Application Scenarios of epoxy potting adhesive
Electronics and Electrical Appliances: Circuit boards, LED power supplies, sensors, capacitors, etc.
Automotive/New Energy: Electronic control units, igniters, motors.
Other: Aerospace, instrumentation, etc.

Package:

This product is 40KG per group;

Component A is 20KG (in barrels), and Component B is 20KG (in barrels)

about us

 

Product Tags: black high-temperature epoxy potting compound   clear epoxy potting adhesive for LED   electrical epoxy potting material for power module  
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