HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems

Product Overview

1. Industry Application Focus
   HN-8810 Potting Compound for Automotive Electronics: Protecting Vehicle Power Systems
   Specifically engineered for automotive applications, this potting compound offers excellent heat resistance, vibration damping, and moisture protection. Ideal for HID ballasts, ignition control modules, and on-board chargers, ensuring long-term reliability in harsh operating environments.

Key Features & Benefits
Excellent Thermal Conductivity – 1.0 W/m·K effectively dissipates heat, prolonging component life.
Wide Operating Temperature Range – Stable performance from -40°C to 150°C.
High Insulation & Flame Retardancy – Volume resistivity ≥5.0×10¹⁴ Ω·cm, UL94 V-0 rated.
Waterproof & Anti-Aging – Protects against moisture, humidity, and long-term degradation.
Easy to Use – 60-120 minutes work time at 25°C, cures fully in 2-4 hours at room temperature.

Typical Applications

Automotive electronics: HID ballasts, ignition control modules

Power supplies & inverters

Network transformers & communication devices

LED drivers & lighting systems

PCB potting and encapsulation

Technical Specifications

How to Use HN-8810 Potting Compound

1. Weighing – Accurately weigh components A and B in a 1:1 ratio.

2. Mixing – Stir thoroughly until uniform color is achieved.

3. Degassing – Vacuum degas to remove entrapped air bubbles.

4. Potting – Pour into clean, dry housing; avoid contamination.

5. Curing – Allow to cure at room temperature or accelerate with mild heat.

Compatibility Notes
Avoid contact with inhibitors such as:

• Organotin compounds

• Sulfur or amine-based materials

• Phosphorous-containing substances

• Acidic residues or flux

Packaging & Storage

1.50 kg/kit (25 kg A + 25 kg B)

2.Store in a cool, dry place away from direct sunlight

3.Shelf life: 6 months in sealed containers