Two Component Epoxy Potting Compound Sealant Moistureproof Low Viscosity

Two-component Epoxy Potting Sealant Moisture-proof Fire Retardant High Temp Conductive Glue for Transformers Resistors Filters Electronic Appliances

HN-5508 Industrial Epoxy Resin Potting Glue

Product Specification

Product Describtion
HN-5508 is a two-component epoxy potting compound designed for room-temperature or low-temperature curing. With low viscosity, extended work time, and excellent fluidity, it penetrates easily into product gaps. After curing, it forms a bubble-free, smooth, and glossy surface with high hardness. The cured material exhibits outstanding resistance to acids, alkalis, moisture, and aging, along with superior electrical insulation, voltage resistance, and bonding strength. Ideal for electronic components requiring encapsulation, insulation, and environmental protection.

Product Advantage
✅ Reliable Protection: Shields against moisture, vibration, and thermal stress.
✅ Versatile: Adapts to diverse electronic and industrial applications.
✅ Cost-Effective: Long pot life reduces waste during processing.

Technical parameters
Viscosity (Component A: 4500-6000 cps, Component B: 150-250 cps)

Hardness (SHORE D): 85-95

Tensile strength: 16-18 kg/cm²

Compressive strength: 18-22 kg/cm²

Application scenarios
High-voltage packaging: used for insulation and protection of high-voltage equipment.

Aquarium equipment: Provide waterproof and moisture-proof sealing.

Ultrasonic atomizer: Enhance the durability and reliability of equipment.

Usage method
Mix according to the weight ratio of A:B = 5:1 and use.

Fully cure in 12-16 hours at 25℃, or 1.5-2 hours at 60-80℃.

Packing specifications
30 KG/group (Component A 25 KG/barrel, Component B 5 KG/can)

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