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electronic module clear adhesive sealant
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Shinetsu KE-45 room temperature curing (oxime) silicone sealant - electronic adhesive Product Basic Attributes KE-45 is a one-component, room ...
2025-12-19 17:56:40
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Basic Product Properties Cemedine 8008B (Black) and 8008W (White) are one-component moisture-curing polyurethane structural adhesives designed for ...
2025-12-19 17:56:43
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DOWSIL™ SE 9187L Low Viscosity Adhesive for Display Module Assembly & Potting Basic Product Properties DOWSIL™ SE 9187 L is a one-part, room ...
2025-12-30 00:28:30
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...Clear and Black variants. It features a 1:1 mix ratio by volume, 60-70 minute worklife at 23°C, designed for potting, sealing, and encapsulation of ...
2026-04-28 16:54:33
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...Electronic Component Encapsulation Silicone Adhesive Product Properties Criteria Properties Appearance Flowable, clear color Viscosity 30 Pa.s Tack...
2025-11-27 09:50:27
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Product Overview Dowsil EE-1100 is a two-part silicone encapsulant designed for electrical and electronic applications. It cures to form a flexible ...
2025-11-27 09:49:16
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Simple Attributes Shin-Etsu KE-45-TS is a one-component, room-temperature curing, thixotropic silicone adhesive that cures to form a tough, durable ...
2025-11-27 09:49:40
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Shin-Etsu KE-1600 One-Component RTV Silicone Adhesive for Electronic Sealing with Weather Resistance
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Shin-Etsu KE-1600 One-Component Silicone: General-Purpose Organosilicon Material for Electronic Sealing and Insulation Protection Basic Properties KE...
2026-02-09 18:18:35
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3M Fluorinert FC-3283 Electronic Liquid - Phase Heat Transfer Fluid Product Simple Attributes 3M Fluorinert Electronic Liquid FC-3283 is a clear, ...
2025-12-19 17:56:37
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DOWSIL™ CC-2588 Conformal Coating for Protection of Electronic Components DOWSIL™ CC-2588 is a one-component, solvent-based silicone conformal coating ...
2026-05-07 13:26:52
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