DuPont Duroptix OE-6370 M A/B Kit Optically Clear Two-Part Silicone LED Encapsulant for SMD LED Package & Dispensing Process

DuPont Duroptix OE-6370 M A/B Kit Optically Clear Two-Part Silicone LED Encapsulant for SMD LED Package & Dispensing Process

DuPont Duroptix™ OE-6370 M is a two-part, 1:1 mix ratio, addition-cure optically clear silicone elastomer (Base/Catalyst), colorless, with moderate mixed viscosity ~3308 cP and heat cure 240 min @150°C, cured to Shore A 71.

Designed for the LED market, OE-6370 M offers high transparency (>99.9% @450nm, 1mm), thermal stability, moisture resistance and unprimed adhesion to LED substrates such as Ag-plated lead frames and PPA. The silicone absorbs thermally induced stresses inside the LED package, protecting the die and bond wires, and withstands lead-free reflow temperatures. It is optimized for pneumatic dispensing processes.

Technical Specifications

Key Special Properties (Expanded)

• Optimized for Pneumatic Dispensing:​ Moderate viscosity (Part A 5848 cP / Part B 2000 cP / Mixed 3308 cP) ensures smooth flow in automated dispensing equipment with long pot life.
• High Purity & Strong Adhesion:​ Na⁺ ≤0.1 ppm, K⁺ ≤0.2 ppm, Cl⁻ ≤0.5 ppm; Unprimed die shear adhesion to Al substrate 1008 psi (7.0 MPa).
• Excellent Mechanical & Optical:​ Tensile Strength 9.2 MPa, Elongation 80%, Refractive Index 1.41, Transparency @450nm 99.9%.
• Wide Operating Range:​ Long-term service temperature –45°C to 200°C; CTE 290 ppm/°C.

OE-6370 M is typically used for encapsulation and protection of SMD (Surface Mount Device) LEDs, high-power multi-chip LED packages, and molded lens formation where dispensing process is preferred. It is also suitable for optical component potting requiring high clarity and stress relief in semiconductor/optoelectronic devices.