The stencil Y position is adjustable via user interface, and the settings can be saved and reapplied when replacing the stencil. This function significantly reduces human errors and saves time in readjusting stencil position.

The stencil lock vacuum suction firmly holds the stencil on both sides of the conveyor during printing cycle, eliminating stencil vibration by having firm contact with the PCB.

The PCB clamper is a combination of retractable top clamp and motor controlled side clamp, uniquely designed by YUSH (patented). With these standard features, all of today’s available and challenging substrates can be securely clamped and print to the highest quality.

Through machine status, parameters can be uploaded automatically. Designed to support customers’ advancement towards Industry 4.0 intelligence production, YSL-GL provides seamless connection with users’ MES system, enhancing product traceability and maintenance needs.

Tracing solder paste rolling diameter in real time and trigger the auto dispensing if it falls below 10mm. Completely eliminate insufficient solder paste on stencil and keep the paste rolling speed within optimum range to achieve best printing result with this smt printer.

The paste is automatically dispensed across the entire squeegee length, maintaining at 15mm rolling diameter, adopting the common 500 grams’ solder paste jar. Completely eliminates the wastage of solder paste overflowing to the sides of squeegee.