Stackable dotting process can create high profile dotting to ensure components will be glued strongly to the PCB. No tailing effect unlike other conventional smt dispenser.

By jetting lines of glue between a series of PTH leads with narrow lead pitch such as connectors and sockets, solder bridging can be eliminated during wave soldering process.

Corner bonding application can be done using our D-Sniper smt dispenser in a single SMT reflow process without any additional investment. SMA is dispensed on the PCB at the corners of BGA prior to placing the BGA. This application is not achievable by traditional contact dispensing as it is unable to create shapes and patterns thats adapted in Corner bonding. Through this application, there will be additional shock and bending resistance provided to the assembly when the PCB undergoes reflow.

(Photo Credits: Henkel AG & Co. KGaA)

Developed to protect components from dust, vibration, moisture, & other environmental condition, offering the longest possible operational lifespan for electronic devices. Without additional investment of conventional spray coating machine, D-Sniper can be converted into a jet coating machine.

D series machine capable to dispense (dot) red glue for mix technology PCB bottom side assembly to enhance mechanical bond strength. With CPK >1.33 accuracy, the dispense speed could perform up to 1000mm / second.

With dual lane, it will reduce the process time significantly, enhancing the throughput performance. It greatly aids in automated & high-mix production environment.