Semi Automatic Dicing system YSL-1000SD
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Detailed Product Description
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Basic Description The dicing system, refers to install a slim blade for special
cutting at the head of the spindle,cut off glass, ceramic,
semiconductor chip, PCB, EMC wire frame and other materials with
high accuracy by using spindle’s high-speed rotation driving the
cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Semi-auto dicing The semi-auto dicing system, refers to a dicing system that loader
and unloader by hand and only the procedure is automated in the
process of dicing. The system is not equipped with automatic
cleaning, drying, etc. Main procedures Feeding by hand Position align Auto-cutting Unloading by hand 1.Operator manually place the material being cut on work platform. 2.The cutting position is automatically calibrated. 3.Press the start button to automatically complete the dicing process of material. 4.Operator take the material manually being cut from the work platform. Applications Automatic dicing system is widely used in semiconductor chip, LED
chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic
thin plate’s precision cutting . Ceramic substrate Silicon rubber Lead frame Silicon wafer PCB Glass Operating Requirements 1.Please use the clean compressed air that its atmospheric pressure
dew point is in the -10 ~ -20℃, and the residual oil is divided
into 0.1ppm, the filtering accuracy is above 0.01um/99.5%. 2.Please use the equipment in a room of temperature between 20 ~ 25
℃, and its fluctuation range control at ±1℃. 3.Please control the temperature of the cutting water at 22 ~ 27 ℃(variation ranges in ±1℃ ), the cooling water at 20 ~ 25 DEG C (variation ranges within plus or ±1℃). 4.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist. 5.Please avoid the equipment to be impacted and any vibration of the outside world. In addition, please do not install the equipment near the device like blower and vent that produces a high temperature and a device that generates oil mist. 6.Please follow the product manual we provided for operation strictly.
Semi-dicing system YSL-1000SD Features of products 1.Using touching LCD to operate. The interface design is simple and
easy. Provide a variety of languages such as Chinese, English,
Korean, etc. 2.Can meet the high precision cutting maximum diameter of 300 mm
materials. 3.High rigidity structure design is adopted to ensure high
precision and high stability of cutting process. 4.CCD automatic align. 5.Real-time monitoring of the system's air pressure, water
pressure, current and other values to avoid spindle damage. 6.Cutting Spindle : 2.4 kw × 1set (Max: 60,000 rpm) 7.Repeat positioning accuracy: 0.001mm 8.Cutting speed: 0.05 ~ 400 mm/sec 9.Standard matching blade: 2 Inch (Max: 3 Inch) Case Sharing
Other Discription Optional equipment 1.Function of blade damage detection; 2.Automatic setting function; 3.Dicing visual function; 4. Using dicing blade with 3 Inch. Ordinary 8 inch working platform can only put 2pcs material. SDS1000/ADS2000 equipped with 12 inch chunk. It can be placed 4pcs
material each time. 1.Reduce the loading times; 2.Meet the larger size of the product; 3.Promote more than 8% efficiency. |
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| Product Tags: semi automatic dicing system PCB dicing machine YSL-1000SD PCBA cleaning machine with warranty | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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