2.1M SiP Advanced Packaging Wafer Level Underfill Machine Flux Jetting Machine

Advanced Packaging Wafer-Level Underfill & Flux Jetting Machine

Mobile Side Key SiP & Capacitor Encapsulation Dual-Valve Precision Dispenser

The GS600 series is a next-generation dual-valve dispensing platform engineered to handle sidewall button sealing and capacitor root encapsulation in advanced SiP (System in Package) production for smartphones and compact consumer electronics.

Equipped with dual-valve synchronous and asynchronous dispensing capability, the GS600 series allows manufacturers to apply different materials or layers in a controlled sequence. Its smart vision system auto-detects the side wall or capacitor position and adjusts the dispensing path in real time to achieve uniform glue lines without excess overflow. This ensures the adhesive properly surrounds the capacitor base without spreading beyond design tolerances.

Key Advantages

• Purpose-built for mobile side button sealing: Delivers tight, neat glue lines along phone side keys to protect against ingress.
• Precision capacitor encapsulation: Wraps adhesive cleanly around the capacitor root to reinforce connections while controlling glue spread.
• Dual-valve configuration: Supports simultaneous or sequential material dispensing, optimizing cycle time for multi-step potting.
• Smart process control: Machine vision, laser height detection, and glue weight monitoring prevent overflow and ensure stable repeatability.
• Compact footprint: Cabinet-style inline system easily integrates into high-volume smartphone and SiP production lines.

Key Applications

✓  Smartphone side button (side-wall) gluing and sealing
✓  Capacitor root encapsulation in SiP modules
✓  Edge sealing for micro-electronics
✓  Selective potting for compact components
✓  Micro-volume dam & fill in tight spaces

Technical Specifications

FAQ

Q1: How does the GS600DD manage glue overflow for tiny capacitors?
A: Its precision valve control, laser height detection, and machine vision auto-correction ensure the glue only covers the capacitor base as designed, minimizing excess spread.

Q2: Can I use different adhesives for side buttons and capacitors?
A: Yes. With dual-valve operation, you can run different adhesive types or viscosities either simultaneously or in sequence for multi-step encapsulation.

Q3: What type of valves are compatible?
A: The GS600 series supports screw valves for thicker materials and piezo jetting valves for micro-volume, low-viscosity adhesives.

Q4: How does it handle continuous production?
A: The system includes glue tank monitoring, low-level alarms, real-time vision tracking, and stable cabinet design for 24/7 operation in modern mobile device lines.

About Mingseal

Mingseal specializes in high-end precision dispensing solutions for semiconductor, SiP, MEMS, smartphone, and other consumer electronics industries. With rich industry expertise and robust R&D, Mingseal helps global manufacturers solve critical challenges in micro-assembly, potting, and advanced packaging — delivering reliable performance and yield improvement for every production line.