130W Advanced Packaging Machine Wafer Level Underfill Flux Jetting Machine

Advanced Packaging Wafer-Level Underfill & Flux Jetting Machine

The GS600SW Wafer-Level Underfill Dispenser is Mingseal’s flagship dispensing module designed for next-generation wafer-level packaging (WLP) and advanced redistribution layer (RDL) processes. Built to handle high-complexity underfill and flux spray operations, it is ideal for Fan-Out Wafer-Level Packaging (FoWLP), CoWoS, and FoPoP applications where ultra-high precision and process consistency are mandatory.

Equipped with a high-stability linear motor transmission, precision screw-driven Z-axis, and a fully integrated vision alignment system, the GS600SW ensures micron-level dot placement and path control. Its robust wafer chuck table delivers exceptional planarity and temperature uniformity—critical for void-free underfill performance.

In addition to underfill dispensing, the GS600SW can be configured with an optional spray valve module to apply flux or adhesives uniformly across wafer surfaces, increasing process flexibility for manufacturers dealing with multi-step flip chip or RDL packaging lines.

Core Advantages

• Optimized for 8-inch & 12-inch Wafers

  Supports standard 200mm and 300mm wafers with adjustable chuck table and wafer cassette options.

• Dual Process Ready: Underfill + Flux Spraying

  Optional spray valve module extends capability to handle flux coating or pre-soldering adhesion processes.

• Precise Wafer Temperature Control

  Advanced vacuum chuck table with uniform heating and real-time feedback ensures stable material flow and void-free filling.

• Ultra-Fine Dot Accuracy

  X/Y positioning accuracy within ±10μm and Z-axis repeatability of ±5μm deliver consistent results for RDL First structures.

Typical Applications

✔ RDL First Fan-Out WLP
✔ CoWoS (Chip-on-Wafer-on-Substrate)
✔ FoPoP (Fan-Out Package-on-Package)
✔ Wafer-Level Underfill
✔ Wafer-Level Flux Spraying
✔ Semiconductor Flip Chip Packaging
✔ Redistribution Layer Adhesive Coating

Technical Specifications

FAQ

Q1: What unique wafer-level applications does the GS600SW target?
A: It’s engineered for RDL First Fan-Out WLP, CoWoS, and FoPoP processes where fine underfill control and flux spraying are both required.

Q2: How does it handle wafer size and warp?
A: It supports standard 8-inch and 12-inch wafers with thicknesses up to 25,500μm and warp tolerance up to 5mm, with flexible wafer box compatibility.

Q3: Can it be integrated into fully automated lines?
A: Absolutely. It can work with Mingseal’s PC101EFEM for full auto wafer handling, pre-alignment, and AMHS robot docking.

Q4: Why choose Mingseal for wafer-level dispensing?
A: With years of experience in semiconductor underfill and fluid dispensing, Mingseal delivers reliable equipment that integrates precision mechanics, stable control, and cleanroom compliance—helping factories reach next-level yield and cost efficiency.

Conclusion

Mingseal is a trusted supplier of inline and wafer-level dispensing solutions for global semiconductor and advanced packaging manufacturers. From underfill to flux coating, our modular systems, intelligent control, and stable design help our partners deliver defect-free products for 5G, high-performance computing, and AI chip markets.