T8 Temper Aluminum CPU Cooling Plate With Anodizing Surface

Aluminum Wide Water Cooling Heat Sinks Head Plate CPU Semiconductor Cooling Sheet

Description:

Product name: water cooling head, water cooling plate.

Material thickness: primary color water cooling head GB 6063A, thickness of 11.5mm ±0.5Blue oxide water cooling head national standard 6063A, thickness 12MM±0.5Copper water cooling head contact surface pure copper, water nozzle brass, thickness of 9.5mm ±0.5 nozzle

Specification: aluminum water cooling head maximum diameter 9.5mm (suitable for the store 7-8mm inner diameter pipe)Maximum outer diameter of copper water cooling head is 8.5mm (suitable for the store's 7MM inner diameter water pipe)

Heat dissipation effect:Material comparison - copper thermal conductivity (401W/mk) is greater than 6063A aluminum thermal conductivity (201W/mk) copper heat dissipation effect is good.Channel Contrast - Finned channels are denser than M-shaped channels and carry away heat more easily.

Therefore, finned channels are superior to M-shaped channels

Packing and delivery

Packaging Details

We have the package advantage:
1) The internal blister tray or pearl wool;
2) external carton packaging.

Delivery Time

1) Sample in 3 workdays after payment.

2) Mass production after payment 20 days.

Welcome to send us the detailed drawings.