Double-Sided Flexible Printing Membrane Printed FPC Circuit

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TKM MEMBRANE TECHNOLOGY LTD.

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:86-0769-82659918-1062

Contact Person:
Ms.Amy View Contact Details

Double-Sided Flexible Printing Membrane Printed FPC Circuit

Minimum Order Quantity	100
Model NO.	HC-FPC-002
Combination Mode	Adhesive Flexible Plate
Conductive Adhesive	Conductive Silver Paste
Flame Retardant	HB
Processing Technology	Electrolytic Foil
Base Material	Aluminum
Insulation Materials	Organic Resin
Average Thickness	1.1-0. Am
Copper Foil Type	Electrolytic and Rolled
Copper Foil Thickness	1oz, 1/2oz, 1/3oz
Substrate Film Thickness	1mil, 1/2mil
Cover Film Thickness	1mil, 1/2mil
Stiffener Thickness	3mil to 9mil
Production Capacity	100,000PCS/Month
HS Code	8536500000

Detailed Product Description

Double-Sided Flexible Printing Membrane Printed FPC Circuit

Double-sided flexible printed circuit (FPC) boards offer exceptional flexibility and reliability for advanced electronic applications requiring compact, lightweight solutions.

Key Features and Benefits

Exceptional Flexibility: Can be bent, folded, and deformed freely with small coil radius and movement along X, Y, Z axes
Space-Saving Design: Light and thin construction (average thickness 1.1-0.1mm) maximizes use of narrow instrument spaces
Lightweight Construction: Optimized for current load rather than mechanical strength, resulting in minimal weight
Superior Sealing Capability: Designed for low-tensile seal performance in adverse environments
Stable Signal Transmission: Freely designed wiring patterns and conductor distances ensure steady RLC parameters
Easy Assembly: Excellent terminal properties for soldering, inserting, riveting, and gluing applications
Enhanced Insulation: Materials like polyimide and polyester provide superior insulation properties

Material Composition

Copper Foil Substrate:

Copper Foil: Electrolytic copper and rolled copper (common thickness: 1oz, 1/2oz, 1/3oz)
Substrate Film: Common thickness of 1mil and 1/2mil
Adhesive: Thickness customized to customer requirements

Cover Film Protection:

Cover Film: Surface insulation (common thickness: 1mil and 1/2mil)
Adhesive: Thickness customized to customer requirements
Prevents adhesive buildup and foreign matter before pressing

Stiffener (PI Stiffener Film):

Reinforces mechanical strength for surface mounting
Common thickness: 3mil to 9mil
Adhesive: Thickness customized to customer requirements

EMI Shielding: Electromagnetic shielding film protects circuit board lines from external interference in high electromagnetic environments.

Competitive Advantages

Shorter Assembly Time: Complete line configuration eliminates extra PCB wiring connection work
Compact Size: Small volume PCB effectively reduces product dimensions
Lightweight: Significantly lighter than traditional rigid PCBs
Thin Profile: Thinner than hard PCB boards, improving flexibility and 3D assembly capabilities
Quick Delivery
Premium Services
OEM/ODM Customization Available

Application Images

Product Tags: double-sided FPC circuit membrane flexible printing membrane switch printed FPC circuit switch

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