High Quality and High Efficiency PCB Laser Cutting Machine designed
specifically for SMT (Surface Mount Technology) production lines,
delivering precision cutting with exceptional performance. Application - Cutting various flexible circuit board materials and cover film
with clean, carbonization-free results
- High-quality, high-speed cutting of rigid materials up to 1mm
(0.04") thickness
- UV light processing through decomposition and vaporization
minimizes burrs
- Minimal thermal effect prevents stratification; produces precise,
smooth cutting edges with steep sidewalls
- Capable of cutting various substrate materials including silicon,
ceramics, and glass
- Precision etching forming of various functional films
- Efficient FPC/PCB cutting, drilling, window covering, fingerprint
identification chip cutting, TF memory card sub-boards, and mobile
phone camera module cutting applications
YSV-7A Product Features - Neat, smooth edges after cutting with no burrs, dust, or particle
residue
- High precision cutting, especially effective for small arcs and
fine cutting applications
- Significantly reduces molding failure rates
- Single-pass cutting capability for composite workpieces with
multiple materials and varying thicknesses
- Automatic laser head height adjustment for easy handling of
double-sided surface-mounted FPC
Basic Specifications and Technical Parameters | Specification/Model | YSV-7A |
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| Laser Head | SP (USA) |
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| Laser Wavelength | 355nm light wave UV laser |
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| Max Power | 10W / 15W / 17W |
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| Worktable Location Precision | ±0.003mm |
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| Worktable Repetition Precision | ±0.002mm |
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