| | Model | YSL-A-BIB | IMAGE RECOGNITION |
| Item | | | CCD FOV | 10x8 mm |
| Screen Frames | Min Size | 470X370mm | Fiducial Types | □square○Round △Triangle,+cross Pad Hole |
| Max Size | 737X550mm737X650mm(200-310) | Automatic Camera System | CCD digital camera |
| Thickness | 25-40mm | Geometrypattern match |
| PCB Min Size | 50X50mm | Lookup down optics structure |
| PCB Max Size | 400X310mm | Working environment temperature | -21-℃-+50℃ |
| PCB Thickness | 0.4-6mm | Humidity of working environment | 30%-60% |
| PCB Warpage | <1% | Power input | AC:220±10%50/60HZ 1&3KW |
| Transport Height | 900±40mm | Control Method | PC Control |
| Transport Direction | Left-Right:Right-Left:Left-Left;Right-Right | Machine Dimensions | 1220(L)X1355W)X1500(H)mm 1220(L)X2800W)X1500(H)mm |
| Transport Speed | Max1500mm/S Programmable | Machine Weight | Approx:1000Kg()2000KG() |
| Board Location PCB | Support System | Magnetic Pin/Up-down table adjusted/support block by hand | PRINTING PARAMETERS |
| Clamping System | side clamping.vacuum nozzle | PCB Max Size | 400X310mm |
| Print head | Two independent motorised printheads | Squeegee Type | Stainless steel(Standard),plastic |
| Cleaning System | Dry,Wet,Vacuum(Programmable) | Substrate Separation | 0.1~20mm/sec |
| Table Adjustment ranges | X:±10mm;Y:± 10mm;;±2º | Separation option | Separation after squeegee up;Squeegee up after Separation ; separation by keeping squeegee on the stencil (Area Separation Line Separation) |
| Solder Paste Inspection | 2DInspection | Squeegee Speed | 6-200mm/sec |
| | Squeegee Pressure | 0~15Kg |
| Squeegee Angle | 60º/55º/45º |
| Repeat Position Accuracy | ±0.008mm(CPK>2.0) |
| Printing Accuracy | ±0.02mm(CPK=>2.0 |
| Cycle Time | <7s(Exclude Printing Cleaning) |
| Product Changeover | <5Min |
| Air Required | 4.5-6 Kg/cm2 |