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3 0mmt thermal pad
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2.5mm Thickness Thermal Gap Pad Ziitek TIF™5100US For Micro heat pipe thermal solutions 18 Shore 00 2.95 g/cc The TIF™5100US Series thermally ...
2025-07-21 00:05:48
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...thermal conductive gap pad 20 shore00 silicone sheet 3.1 g/cc for mainboard/mother board The TIF580-40-11US use a special process, with silicone as ...
2025-07-21 00:05:48
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...pads for power supply,3.15g/cm3 The TIF1120-40-11US use a special process, with silicone as the base material, adding thermal conductive powder and ...
2025-07-21 00:05:47
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...pads for Memory Modules The TIF160-01US use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-07-21 00:05:47
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... and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between ...
2025-07-21 00:05:47
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... together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and ...
2025-07-21 00:05:47
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...Pads Soft and Compressible for Low Stress Applications for CPU The TIF160-10UF use a special process, with silicone as the base material, adding ...
2025-07-21 00:05:47
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...Pad for MD LED Module The TIF1160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ...
2025-07-21 00:05:47
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...Pads for Waterproof LED Power The TIF1200N-40-10F use a special process, with silicone as the base material, adding thermal conductive powder and ...
2025-07-21 00:05:47
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... together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and ...
2025-07-21 00:05:48
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