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2 5mmt gap pad
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1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as ...
2025-07-20 00:05:57
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1.0mmT High tack surface reduces contact resistance silicone pads for GPS navigation The TIF140-30-06UF is recommended for applications that require a ...
2025-07-20 00:05:57
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1.75mmT Heat Snk Pad Easy Release Construction for Display Card The TIF170-30-06UF use a special process, with silicone as the base material, adding ...
2025-07-20 00:05:57
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Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that ...
2025-07-20 00:05:57
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Specific Gravity 2.2 g/cc Silicone Pads Soft and Compressible for Low Stress Applications for CPU The TIF160-10UF use a special process, with silicone ...
2025-07-20 00:05:57
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2.5mm Gray Outstanding Thermal Performance Conductive Pads For Display Card The TIF1100-10UF is recommended for applications that require a minimum ...
2025-07-20 00:05:57
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Specific Gravity 2.7 g/cc Outstanding Thermal Performance Conductive Pads for CPU The TIF160-20-10UF use a special process, with silicone as the base ...
2025-07-20 00:05:57
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-40 to 160℃ UL Recognized Silicone Pads for Heat Pipe Thermal Solutions The TIF1100-20-10UF is recommended for applications that require a minimum ...
2025-07-20 00:05:57
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75 Shore 00 Easy Release Construction Heat Sink Pad for MD LED Module The TIF1160-20-10UF use a special process, with silicone as the base material, ...
2025-07-20 00:05:57
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Electrically Isolating Gray TIF140N-50-10F Thermal Pad for LED TV The TIF140N-50-10F is recommended for applications that require a minimum amount of ...
2025-07-20 00:05:57
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