High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR
|
|
High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR
Company Profile
Ziitek Electronic Material and Technology Ltd With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
The TIF®500 Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs,achieving the best balance between cost and performance.
> Good thermal conductivity
Applications
Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Product Specifications Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm) Standard Size: 16"X16" (406 mm×406 mm) Component Codes: Reinforcement Fabric: FG (Fiberglass). Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening). Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive). The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us. Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Questions
Q: Are you trading company or manufacturer ? A: We are manufacturer in China.
Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the process and send your message to us 4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just contact us by send email or call us. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: 35 Shore OO thermal conductive pad 5G aerospace thermal pad AIoT AR/VR thermal pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Silicone Based Thermal Interface Material 8.5W Soft Thermal Pad For Electric Vehicle |
|
High Compressibility Soft 6.0W Thermally Conductive Gap Filler Pads For Medical Equipment |
|
High Thermally Conductive 15W/MK Soft Thermally Conductive Gap Filler Pads For 5G Base Stations |
|
Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle |
|
|
Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI |
|
|
Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom |
