Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad
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Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
The TIF®200-04ES Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation,such as power devices, new energy vehicles, and portable electronic devices.
> Good thermal conductivity
Applications
Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Product Specifications Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm) Standard Size: 16"X16" (406 mm×406 mm) Component Codes: Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening). Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive). The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us. Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''. 2.Our core competencies is thermal conductive interface materials 3.Competitive advantage products. 4.Condidentiality agreement Bussiness Secrect Contract 5.Free sample offer 6.Quality assurance contract
Questions
Q: Are you trading company or manufacturer ? A: We are manufacturer in China.
Q: How long is your delivery time? A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost? A: Yes, we could offer samples free of charge. |
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| Product Tags: thermally conductive silicon pad heat resistant thermal gap pad 1.0 W/MK thermal conductive pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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