Customized Self Adhesive Thermal Gap Filler Pad Silicone Thermal Pad
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Customized Self Adhesive Thermal Gap Filler Pad Silicone Thermal Pad
TIF®100 10055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.
Features: > Naturally tacky needing no further adhesive coating > RoHS compliant
> Telecommunication equipment > LED drivers and lamps > Mass storage devices > Auditioning electronic products
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm) Consult the factory to alternate thickness.
Product Specification Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm) Product Sizes:16" x 16"(406mm x406mm) Component Codes: Reinforcement Fabric: FG (Fiberglass). Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening). Adhesive Options: A1/A2(Single-sided/Double-sided adhesive). Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm). The TIF series is available in custom shapes and various forms.For
other thicknesses or more information, please contact us. Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Well-trained & experienced staff are to answer all your inquiries in English of course. Standard Export Carton Or Marked With Customer's Information Or Customized. Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof. we will help you to deal with it and give you satisfactory solution. |
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| Product Tags: Self Adhesive Thermal Gap Filler Pad Customized Thermal Gap Filler Pad Silicone Thermal Gap Filler Pad | ||||||||||||||||||||||||||||||||||||
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