Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling
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Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling
The TIF7100Z is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
TIF700Z-Series-Datasheet(E)-REV01.pdf
Features
> Good thermal conductive: 7.0 W/mK > Thickness: 2.5mmT > hardness:55 shore 00 > Colour: Grey < Naturally tacky needing no further adhesive coating
Applications
> Cooling components to the Chassis of frame
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ:
Q:How can we get detailed price list? A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity. Q:Is there promotion price for big buyer? A:Yes, we do have promotion price for big buyer. Please send us email for inquiry. |
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| Product Tags: CPU Cooling Thermal Pad 2.5mm Thickness Thermal Pad UL Certification Thermal Gap Pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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