China Thermal Pad With Heat Conductive Pad 3.0mmT For Display Card
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China Thermal Pad Wholesaler With Heat Conductive Pad 3.0mmT For Display Card
The TIF7120L-HM is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF700L-HM-Series-Datasheet-REV02.pdf
Features
> Good thermal conductive: 6.0 W/mK > Thickness: 3.0mmT > hardness:30 shore 00 > Colour: Grey > Moldability for complex parts Applications
> Cooling components to the chassis of frame
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Standard Sheets Sizes: 8" x 16"(203mm x 406mm) TIF™ series Individual die cut shapes can be supplied.
FAQ:
Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just contact us by send email or call us. Q: What's the thermal conductivity test method given on the data sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. |
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| Product Tags: Display Card Thermal Pad 6.0 W/m-K Heat Conductive Pad 3.0mmT Thermal Pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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