Professional Thermal Conductive Pads For RDRAM Memory Modules
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Professional And Good Performance Conductive Pads For RDRAM Memory Modules
The TIF7180M use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features > Good thermal conductive: 6.0 W/mK >Thickness: 4.5mmT >hardness:45±5 shore 00 >Colour: Grey >RoHS compliant
Applications >cooling components to the chassis of frame >High speed mass storage drives >Heat Sinking Housing at LED-lit BLU in LCD >LED TV and LED-lit lamps >RDRAM memory modules >Micro heat pipe thermal solutions
Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Packaging Details & Lead time
The packaging of thermal pad 1.with PET film or foam-for protection 2. use Paper Card To Separate Each Layer 3. export carton inside and outside 4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000 Est. Time(days): To be negotiated
FAQ: Q: How do I request customized samples? A: To request samples, you can leave us message on website, or just
contact us by send email or call us. Q: What's the thermal conductivity test method given on the data
sheet ? A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity. |
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Product Tags: 6.0 W/m-K Thermal Conductive Pads RDRAM Memory Modules Conductive Pads TIF7180HM Thermal Pad |
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