4.0mmT Heat Sink Pad For Telecommunication Hardware -40 To 160℃
|
|
4.0mmT High Cost-effective Heat Sink Pad For Telecommunication Hardware, -40 to 160℃
The TIF7160M thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
Features > Good thermal conductive: 6.0 W/mK > Thickness: 4.0mmT > hardness:45±5 shore 00 > Colour: Grey > Moldability for complex parts
Applications >Automotive engine control units >Telecommunication hardware >Handheld portable electronics >Semiconductor automated test equipment (ATE) >CPU >display card
Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
FAQ: Q: How do I place an order? A:1. Click the "Sent messages" button to continue with the process. 2. Fill out the message form by entering a subject line, and
message to us. This message should include any questions you might have about the
products as well as your purchase requests. 3. Click the "Send" button when you are finished to complete the
process and send your message to us 4. We will reply you as soon as possible with Email or online. |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Tags: 4.0mm Thickness Heat Sink Pad Telecommunication Hardware Heat Sink Pad 45 Shore 00 Thermal Pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Sticky Soft Heatsink Cooling Gap Filler Thermal Conductive Silicone Pad |
|
Thermal Conductivity 8.0W/m-K Heat Sink Thermal Pad for Electronic Devices CPU PC GPU |
|
Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop |
|
2.5mmT Thickness 8W/mk Thermal Silicone Pad for AI Thermal Interface Material |
|
Thermal Interface Material Pads Thermal Silicone Pad For New Energy Vehicle Batteries PCB |
|
Material Specific Thermal Conductivity Thermal Pad For Audio Video Devices |