3.0mmT Thermal Gap Pad Conductive For CD-Rom
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3.0mmT Soft and Compressible for Low Stress Applications Conductive Pads for CD-Rom
The TIF1120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
TIF100-20-10UF-Datasheet-REV02.pdf
Features > Good thermal conductive: 2.0 W/mK >Thickness: 3.0mmT >hardness:75 shore 00 >Colour: Gray >Moldability for complex parts
Applications >Automotive electronics >Set top boxes >Audio and video components >IT infrastructure >GPS navigation and other portable devices >CD-Rom, DVD-Rom cooling
Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
FAQ: Q: Do you offer free samples ? A: Yes, we are willing to offer free sample. Q: What is your terms of payment ? A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days. |
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| Product Tags: 3.0mm thermal gap pad CD Rom thermal gap pad 3.0mm silicone thermal pad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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